Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. A portion of the one or more optical fibers that is in contact with the support may be bent. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.

Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. A portion of the one or more optical fibers that is in contact with the support may be bent. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.

Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.

Abstract: An aftertreatment system is disclosed. The aftertreatment system includes an exhaust conduit and a selective catalytic reduction module. The aftertreatment system also includes a reductant supply system. The reductant supply system includes a reductant tank, a reductant injector, and a pump assembly. The pump assembly includes a reversing valve assembly and a pump unit. The pump assembly also includes a plurality of check valves, a pressure sensor, and a filter. Further, the reductant supply system includes a back flow valve assembly. The reductant supply system also includes at least two header units associated with the pump assembly. The at least two header units include a reductant draw conduit and at least one heat exchanger. The at least two header units also include a bag filtration assembly.

Abstract: A plug connector for connecting a cable to a receptacle connector includes a housing (209) comprising an upper housing portion (212) assembled to a lower housing portion (211), the assembled portions defining a cavity (280) within the housing. One or more pr ted circuit boards (201, 202) are disposed in the housing cavity and a cable (100) is disposed in the housing cavity and connected to printed circuit boards. The assembled upper and lower housing portions define a first housing sidewall comprising an upper sidewall portion (221u) at the upper housing portion and a lower sidewall portion (221b) at the lower housing portion. The upper and lower sidewall portions define a gap (220-1) in the first housing sidewall at an interface between the upper and lower sidewall portions of the first housing sidewall. The gap extends only partially or at least partially along a length of the first housing sidewall.

Abstract: A plug connector for connecting optical fibers to an electrical receptacle connector includes a housing defining a cavity therein. At least one printed circuit board (PCB) is disposed in the housing cavity. The PCB includes one or more optoelectronic components disposed on its top surface and electrical contacts disposed proximate a mating edge of the PCB for mating with the receptacle connector. The electrical contacts are electrically connected to the one or more optoelectronic components. One or more optical fibers enter the housing cavity through a housing opening and are optically coupled to the optoelectronic components. A structure comprising a top surface is disposed within the housing cavity between the housing opening and the PCB. The plurality of the optical fibers extends over the top surface of the structure and over at least a portion of the top surface of the PCB.

Abstract: A method for filling a reductant tank is disclosed. The method includes creating a lower air pressure within the reductant tank than a pressure of an external reductant reservoir using the first valve, the second valve, and the venturi. The method also includes determining a level of a reductant in the reductant tank. The method further includes engaging the tank fill coupling mechanism with the external reductant reservoir. The method includes supplying the reductant from the external reductant reservoir into the reductant tank based on a pressure difference between the air pressure within the reductant tank and the pressure of the external reductant reservoir. The method also includes shutting-off the supply of the reductant based, at least in part, on the level of the reductant in the reductant tank. The method further includes disengaging the tank fill coupling mechanism from the external reductant reservoir.

Abstract: An aftertreatment system for the transport of fluid reductant to an exhaust of a combustion engine is provided. The aftertreatment system includes a reductant tank configured to store the reductant. The reductant tank has an in-tank filter. A pump module is fluidly coupled to the reductant tank. The pump module includes a pump housing, a pump motor, a pump filter and a pump. The pump is connected downstream of the pump filter. A pressure sensor is connected downstream of the pump. A return conduit is configured to return a portion of the reductant from downstream of the pump to upstream of the pump. A pressure regulator is present within the return conduit. The pump housing is structured and arranged to enclose the pump filter, the pressure sensor, the return conduit, the pump motor and the pressure regulator. A reductant injector is fluidly coupled to the pump module.

Abstract: A method of forming a fiber optic device includes securing one or more optical fibers to a support. The support is coupled to a base that includes one or more optoelectronic devices. After one or more of the fibers are secured to the support, and the support is secured to the base, one or more of the fibers are cleaved. This method, and fiber optic devices made using this method are more easily aligned and may be produced at lower costs than existing manufacturing processes.

Abstract: A colored adhesive useful for an optical fiber connection or termination, containing an adhesive component having a viscosity between about 200 centipoise and about 5000 centipoise, a colorant which is soluble in the adhesive component having a first color before exposure to radiation having a wavelength of from about 400 to about 1100 nanometers, and a second color after exposure to radiation, and an initiator system to cure the adhesive composition by exposure to the radiation.