Abstract: The enhanced folded flexible cable packaging for use in optical transceivers of the present invention provides a 90 degree transition between an optical signal input/output at a communication chassis bulkhead, and folds 180 degrees around a horizontal heat spreader to provide the capability to wire electrical components to the flexible cable while maintaining the upper surface of the electrical components in close proximity to a heat sink. This allows signals to be processed through a multi-layer flexible cable providing electrical performance without the mechanical stiffness associated with the bends that occur in the package. The multiple array transceiver makes the 90 degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink attached to the flexible cable and the heat spreader, which concurrently mounts and locates the transceiver to a common host board.

Abstract: An optical fiber link module adapted to receive a fiber optic cable. The optical fiber link module comprises a multiple array lens and a female connector. The female connector is disposed around the multiple array lens, and has an internal cavity. An electromagnetic shield is disposed in the internal cavity, and has a single central aperture sized to permit communication by the multiple array lens through the central aperture.

Abstract: The packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring of the present invention provides a 90-degree transition between an optical signal input/output at a communication chassis bulkhead, and provides an attachment to a heat spreader for use in wiring electrical components to the flexible cable. The packaging architecture system comprises a forward vertical carrier having an optical converter, a rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier, a heat spreader, and a flexible cable attached to the sides of the heat spreader. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink that is attached to the heat spreader which concurrently mounts and locates the transceiver to a common host board.

Abstract: An optical fiber link module comprises upper and lower portions and a shield. One of the upper portion or lower portion has a groove, and one of the upper portion or lower portion has at least one tab extending therefrom. The shield has a detent and at least one cutout, the detent engaging the groove and the at least one cutout cooperating with the at least one tab.

Abstract: An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The surface of the stiffener includes one or more cavities configured for receiving the electrical components that protrude from the flexible circuit. The stiffener may also include solder posts for mounting the stiffener on a rigid circuit board of an electronic device incorporating the transceiver, with the solder posts having a shoulder for spacing the stiffener at a predetermined distance from the circuit board of the electronic device. The stiffener may also include provisions for attaching a heat sink. The optical transceiver may include the flexible circuit, heat sink, and rigid circuit board.

Abstract: The packaging architecture for a multiple array transceiver using a flexible cable and stiffener for customer attachment of the present invention provides a 90 degree transition between an optical signal input/output at a communication chassis bulkhead, and an provides for a ball grid array attachment to a common host board. The packaging architecture system comprises a forward vertical carrier having an optical converter; a stiffener block, the stiffener block oriented about 90 degrees from the forward vertical carrier; and a flexible cable electrically connecting the optical converter of the forward vertical carrier to a solder ball array aligned with the stiffener block. The multiple array transceiver makes the 90 degree transition within a narrow gap established by industry and manufacturing standards.

Abstract: The packaging architecture for a multiple array transceiver using a flexible cable of the present invention provides a 90-degree transition between an optical signal input at a communications chassis bulkhead and an interior board within the communications chassis. The packaging architecture system comprises a forward vertical carrier having an optical converter, a paddle card, a flexible cable operably connected between the forward vertical carrier and the paddle card, and a rearward horizontal I/O block operably connected to the paddle card, the rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturer standards. The multiple array transceiver further provides cooling through a heat sink.

Abstract: An optical fiber link module adapted to receive a fiber optic cable. The optical fiber link module comprises a multiple array lens and a female connector. The female connector is disposed around the multiple array lens, and has an internal cavity. An electromagnetic shield is disposed in the internal cavity, and has a single central aperture sized to permit communication by the multiple array lens through the central aperture.

Abstract: The present invention provides a fiber optic lens assembly and method of mounting a lens array in the same. The fiber optic lens assembly includes a housing including a lens mounting aperture formed therein. The housing includes at least one feature adjacent the lens mounting aperture. A lens array is positioned within the lens mounting aperture and adjacent the feature. At least one biasing member is positioned adjacent the lens array. The biasing member forces the lens array against the feature. The method includes positioning the lens array adjacent at least one feature formed in a lens mounting aperture of a housing. At least one biasing member is inserted in the lens mounting aperture adjacent the lens array. A cornering force is applied against the lens array with the biasing member.

Abstract: The packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring of the present invention provides a 90-degree transition between an optical signal input/output at a communication chassis bulkhead, and provides an attachment to a heat spreader for use in wiring electrical components to the flexible cable. The packaging architecture system comprises a forward vertical carrier having an optical converter, a rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier, a heat spreader, and a flexible cable attached to the sides of the heat spreader. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink that is attached to the heat spreader which concurrently mounts and locates the transceiver to a common host board.

Abstract: An optical fiber link module comprises upper and lower portions and a shield. One of the upper portion or lower portion has a groove, and one of the upper portion or lower portion has at least one tab extending therefrom. The shield has a detent and at least one cutout, the detent engaging the groove and the at least one cutout cooperating with the at least one tab.

Abstract: The present invention provides methods for aligning a fiber optic cable with an optical component on a device carrier using a fiber optic lens assembly. One method provides that movement of the lens assembly is fixed with respect to the fiber optic cable. Light is sent through the lens assembly. The fixed lens assembly and fiber optic cable are moved with respect to the device carrier. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the device carrier according to the monitored light. Another method provides that movement of the lens assembly is fixed with respect to the device carrier. Light is sent through the lens assembly. The fixed lens assembly and device carrier are moved with respect to the fiber optic cable. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the fiber optic cable according to the monitored light.

Abstract: The packaging architecture for a multiple array transceiver using a continuous flexible circuit of the present invention provides a 90-degree transition between an optical signal input at a communications chassis bulkhead and an interior board within the communications chassis. In one form, the multiple array transceiver comprises a forward vertical carrier having an optical converter, such as a laser or a photodetector, a rearward horizontal block oriented about 90 degrees from the forward vertical carrier, and a flexible circuit having a plurality of electrical layers between the forward vertical carrier and the rearward horizontal block. The flexible circuit can have a power layer, a ground layer, and a signal layer. The multiple array transceiver can further provide a heat sink, a ground land and a power land on the vertical carrier face, and a lens housing assembly aligning an optical lens array with the optical converter.

Abstract: An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The surface of the stiffener includes one or more cavities configured for receiving the electrical components that protrude from the flexible circuit. The stiffener may also include solder posts for mounting the stiffener on a rigid circuit board of an electronic device incorporating the transceiver, with the solder posts having a shoulder for spacing the stiffener at a predetermined distance from the circuit board of the electronic device. The stiffener may also include provisions for attaching a heat exchanger. The optical transceiver may include the flexible circuit, heat sink, and rigid circuit board.

Abstract: An optical fiber link module comprises an upper connector and a lower portion. The upper connector comprises metal, and the lower portion is connected to the upper connector. The lower portion has a pair of arms for retaining a fiber optic cable.

Abstract: An optical fiber link module comprises a die carrier, an input/output connector half, and a circuit cable. The die carrier has a generally planar edge, and at least one optical die is disposed on the edge of the die carrier. The input/output connector half has a generally planar surface disposed perpendicularly to the edge of the die carrier, and has an input/output connection. The circuit cable is connected between the optical die and the input/output connection.

Abstract: The present invention provides a fiber optic transceiver assembly, a fiber optic connector assembly for receiving a fiber optic cable, and a method of dissipating heat in a fiber optic transceiver. The fiber optic transceiver assembly includes a connector housing and a heat sink operably attached to the connector housing. Heat generated within the connector housing is dissipated through both the connector housing and the heat sink. The fiber optic connector assembly includes a first housing member including a socket formed therein, a latch arm assembly positioned adjacent the socket, and a second housing member operably attached to the first housing member. The latch arm assembly is retained by the first and second housing members. The method of dissipating heat in the fiber optic transceiver includes attaching a heat sink to a connector housing and transferring heat generated by the fiber optic connector through both the connector housing and the heat sink.

Abstract: This invention is an improved method and apparatus for applying fluids onto a selected area of a component. The method uses a thin film or membrane formed by placing a forming tool in the fluid to be applied. A thin film or membrane is formed across the forming tool, which is analogous to a soap bubble formed across a bubble wand dipped into a soap bubble solution. The thin film is brought into contact with the area of the component to be coated thereby resulting in the transfer of the thin film onto the component and a variation of the thin fluid film or membrane forming tool that allows for a continuous feed application.