Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Abstract: The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal enhancement feature can enhance a heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

Abstract: A power overlay (POL) module includes a semiconductor device having a body, including a first side and an opposing second side. A first contact pad defined on the semiconductor device first side and a dielectric layer, having a first side and an opposing second side defining a set of first apertures therethrough, is disposed facing the semiconductor device first side. The POL module, includes a metal interconnect layer, having a first side and an opposing second side, the metal interconnect layer second side is disposed on the dielectric layer first side) and extends through the set of first apertures to define a set of vias electrically coupled to the first contact pad. An enclosure defining an interior portion is coupled to the metal interconnect layer first side, and a phase change material (PCM) is disposed in the enclosure interior portion.

Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Abstract: Devices and methods are provided herein useful to thermal management. In some embodiments, a thermal management device includes a housing with a fixed amount of working fluid disposed therein. The substrate is in thermal communication with the thermal management device such that evaporation of the working fluid controls the temperature of the substrate. Evaporated working fluid exits the housing through one or more vents. The housing further includes a plurality of supports that increase the surface area to volume ratio of the housing. The high surface area to volume ratio of the housing increases the rate of heat transfer and also minimizes or otherwise reduces the size and weight of the thermal management device. The supports may further serve to mechanically support the substrate, enabling the housing to act as a combined thermal and mechanical device.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal energy storage reservoir positioned within the vapor chamber contains a phase change material for absorbing thermal energy.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a dual-modal cooling structure can enhance heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a dual-modal cooling structure can enhance heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal enhancement feature can enhance a heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply may be in fluid communication with at least one fluid passageway that passes through the outer wall to deliver a flow of cooling fluid to the stagnation point. In addition, a nose cover is positioned at least partially over or within the at least one fluid passageway and is formed from a material that ablates or melts when the leading edge is exposed to a predetermined critical temperature, the nose cover being configured for restricting the flow of coolant until the nose cover is ablated or melted away.

Abstract: An electric motor may include a stator assembly comprising a stator housing, and one or more rotors coupled to the stator by a rotor shaft assembly. The stator housing may include a cooling structure that has a plurality of cooling body portions and a plurality of cooling conduits defined by the plurality of cooling body portions. A method of forming a stator housing for an electric machine may include additively manufacturing a stator housing that includes a cooling structure defining a fluid domain, coupling a working fluid source to the stator housing and introducing a working fluid into the fluid domain defined by the cooling structure, and sealing the cooling structure with the working fluid contained within the fluid domain of the cooling structure.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply provides a flow of cooling fluid to a porous tip that is joined to the forward end of the outer wall and defines variable porosity and/or internal barriers to direct a flow of cooling fluid to the regions of the leading edge experiencing the highest thermal loading.

Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. The leading edge assembly includes a plurality of structural layers and a plurality compliant layers alternately stacked with each other to facilitate thermal expansion and movement between the plurality of structural layers, while also providing a thermal break between the plurality of structural layers.

Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.

Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.