Patents by Inventor Brian Massey
Brian Massey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11918544Abstract: An apparatus implements a food storage system. The apparatus includes a lid and a cup. An opening in the lid is structured to pass material, expelled from a mouth of a user of the apparatus, to the cup. A first flange on a first side of the lid protrudes up from the lid. A second flange on a second side of the lid protrudes up from the lid. The second side is opposite the first side. A lip rest is between the first flange and the second flange.Type: GrantFiled: May 4, 2021Date of Patent: March 5, 2024Inventor: Brian Massey
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Publication number: 20210338534Abstract: An apparatus implements a food storage system. The apparatus includes a lid and a cup. An opening in the lid is structured to pass material, expelled from a mouth of a user of the apparatus, to the cup. A first flange on a first side of the lid protrudes up from the lid. A second flange on a second side of the lid protrudes up from the lid. The second side is opposite the first side. A lip rest is between the first flange and the second flange.Type: ApplicationFiled: May 4, 2021Publication date: November 4, 2021Inventor: Brian Massey
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Patent number: 8233217Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: GrantFiled: April 1, 2011Date of Patent: July 31, 2012Assignee: Prysm, Inc.Inventors: David Kindler, Sergey A. Bukesov, Roger A. Hajjar, Amit Jain, David L. Kent, Phillip H. Malyak, Brian Massey, John Ritter, John Uebbing
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Patent number: 8203785Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: GrantFiled: April 1, 2011Date of Patent: June 19, 2012Assignee: Prysm, Inc.Inventors: David Kindler, Sergey A. Bukesov, Roger A. Hajjar, Amit Jain, David L. Kent, Phillip H. Malyak, Brian Massey, John Ritter, John Uebbing
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Patent number: 8000005Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: GrantFiled: August 31, 2006Date of Patent: August 16, 2011Assignee: Prysm, Inc.Inventors: David Kindler, Sergey A. Bukesov, Roger A. Hajjar, Amit Jain, David L. Kent, Phillip H. Malyak, Brian Massey, John Ritter, John Uebbing
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Publication number: 20110181948Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: ApplicationFiled: April 1, 2011Publication date: July 28, 2011Applicant: PRYSM, INC.Inventors: David Kindler, Sergey A. Bukesov, Roger A. Hajjar, Amit Jain, David L. Kent, Phillip H. Malyak, Brian Massey, John Ritter, John Uebbing
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Publication number: 20110176208Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: ApplicationFiled: April 1, 2011Publication date: July 21, 2011Applicant: PRYSM, INC.Inventors: David Kindler, Sergey A. Bukesov, Roger A. Hajjar, Amit Jain, David L. Kent, Phillip H. Malyak, Brian Massey, John Ritter, John Uebbing
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Patent number: 7410088Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.Type: GrantFiled: September 5, 2003Date of Patent: August 12, 2008Assignee: Matsushita Electric Industrial, Co., Ltd.Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel S. Sossong
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Patent number: 7293922Abstract: A method of adjusting the attachment of an optical fiber to a laser diode chip within a butterfly package, or any equivalent package, identifies the location of the solder attachment on the optical fiber, thereby moving one or more high power lasers so that their respective beams are incident on the solder attachment. Then, with the application of high power laser pulses according to a predetermined pulse schedule, the solder attachment is heated so that the optical fiber may shift vertically therein. By using an internal or external monitoring means such as an optical power meter, a determination is made when the optical alignment has reached a desired threshold such as when it exceeds a desired optical power output. The pulse schedule may be performed multiple times until a substantially optimized coupling is achieved for the final package.Type: GrantFiled: June 2, 2004Date of Patent: November 13, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Brian Massey
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Publication number: 20070228927Abstract: Fluorescent screens and display systems and devices based on such screens using at least one excitation optical beam to excite one or more fluorescent materials on a screen which emit light to form images. The fluorescent materials may include phosphor materials and non-phosphor materials such as quantum dots.Type: ApplicationFiled: August 31, 2006Publication date: October 4, 2007Inventors: David Kindler, Roger A. Hajjar, Phillip H. Malyak, David L. Kent, John Uebbing, Brian Massey
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Patent number: 7201519Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.Type: GrantFiled: February 7, 2006Date of Patent: April 10, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Brian Massey
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Patent number: 7140783Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.Type: GrantFiled: February 6, 2004Date of Patent: November 28, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Brian Massey
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Publication number: 20060133735Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.Type: ApplicationFiled: February 7, 2006Publication date: June 22, 2006Inventor: Brian Massey
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Patent number: 7021838Abstract: A method of optimally aligning an optical fiber to a semiconductor laser diode, aligns the optical fiber to the semiconductor laser diode, attaches a solder preform onto the optical fiber, and applies a low power localized heat to the solder preform in order to thermally shift the optical fiber downward into an optimized alignment. The method may further include intermediate alignment steps including application of a preload force on the fiber in a direction compensatory to the direction of misalignment, and activation of a high power localized heat to reflow the solder so that the fiber may be moved to the optimized position. These steps may be performed multiple times until a substantially optimized coupling is achieved.Type: GrantFiled: December 16, 2003Date of Patent: April 4, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Brian Massey
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Publication number: 20050271332Abstract: A method of adjusting the attachment of an optical fiber to a laser diode chip within a butterfly package, or any equivalent package, identifies the location of the solder attachment on the optical fiber, thereby moving one or more high power lasers so that their respective beams are incident on the solder attachment. Then, with the application of high power laser pulses according to a predetermined pulse schedule, the solder attachment is heated so that the optical fiber may shift vertically therein. By using an internal or external monitoring means such as an optical power meter, a determination is made when the optical alignment has reached a desired threshold such as when it exceeds a desired optical power output. The pulse schedule may be performed multiple times until a substantially optimized coupling is achieved for the final package.Type: ApplicationFiled: June 2, 2004Publication date: December 8, 2005Inventor: Brian Massey
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Publication number: 20050265669Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.Type: ApplicationFiled: July 6, 2005Publication date: December 1, 2005Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel Sossong
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Publication number: 20050175296Abstract: A method of aligning an optical fiber to a laser diode obtains first light from the laser at a point designated as the center of a planar geometric shape. Data points are taken at the vertices of the shape, whereby a scan measures alignment quality at each of the vertices and the center. The scan begins by obtaining data at the center and moves to a vertex and the remaining vertices in either a clockwise or counterclockwise fashion. Alignment qualities are compared and the location of highest alignment quality is designated as a new center. The scan repeats until the location of the new center remains unchanged, whereby the new center becomes the point of alignment. Alternately, the scan iteration may repeat with increased resolution by reducing the size of the geometric shape and/or increasing the power from the laser until a point of alignment is found at highest resolution.Type: ApplicationFiled: February 6, 2004Publication date: August 11, 2005Inventor: Brian Massey
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Publication number: 20050129371Abstract: A method of optimally aligning an optical fiber to a semiconductor laser diode, aligns the optical fiber to the semiconductor laser diode, attaches a solder preform onto the optical fiber, and applies a low power localized heat to the solder preform in order to thermally shift the optical fiber downward into an optimized alignment. The method may further include intermediate alignment steps including application of a preload force on the fiber in a direction compensatory to the direction of misalignment, and activation of a high power localized heat to reflow the solder so that the fiber may be moved to the optimized position. These steps may be performed multiple times until a substantially optimized coupling is achieved.Type: ApplicationFiled: December 16, 2003Publication date: June 16, 2005Inventor: Brian Massey
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Publication number: 20050051598Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.Type: ApplicationFiled: September 5, 2003Publication date: March 10, 2005Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel Sossong
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Patent number: 6788855Abstract: An apparatus aligns an optical fiber array, that has first and second ends, to an optical fiber light source at the first end of the optical fiber array by using an image of the second end of the optical fiber array captured by a CCD camera, while the first end of the optical fiber array is moved relative to the optical fiber light source. The apparatus includes a controller, coupled to an alignment stage which moves the first end of the optical fiber array and a variable optical attenuator located between the second end of the optical fiber array and the camera. The controller controls the fiber optic alignment device responsive to signals provided by the electronic camera. The camera is used for rough alignment and an optical power meter, coupled to the alignment stage is used for fine alignment.Type: GrantFiled: June 14, 2002Date of Patent: September 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Brian Massey, Russel S. Sossong