Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier which comprises one or more microcells on a substrate having at least one terminal. At least one ESD protection element is operably coupled to the at least one terminal.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coulping the primary bus lines to the at least one segmented secondary bus line.

Abstract: An optical assembly has a socket for receiving a fiber termination ferrule. A PIN diode is on a lead frame encapsulated in a transparent body. As a fiber ferrule is pushed into the socket the electronic output from the diode is monitored to determine optimum insertion distance.

Abstract: An optical assembly has a socket for receiving a fibre termination ferrule. A PIN diode is on a lead frame encapsulated in a transparent body. As a fibre ferrule is pushed into the socket the electronic output from the diode is monitored to determine optimum insertion distance.

Abstract: An electro-optical device (1) has a lead frame (3) having a through-hole (10) acting as a locating feature for a mould pin for moulding a body (4) incorporating a lens (5). The hole (10) is also used as a reference for a placement machine placing a component (2) within 1.5 mm of it. Subsequently, after withdrawal of the mould pin a recess (35) remains, which can act as a locating feature for a waveguide termination connecting to the device. Also, the device comprises a ground plane (55) bonded to the back of the moulded body (53) or (72) incorporated in the lead frame.

Abstract: An optical assembly has a socket for receiving a fibre termination ferrule. A PIN diode is on a lead frame encapsulated in a transparent body. As a fibre ferrule is pushed into the socket the electronic output from the diode is monitored to determine optimum insertion distance.