Abstract: An apparatus for aligning and orienting a semiconductor die (“die”) to be transferred to a substrate. The apparatus includes an alignment mechanism to align the die to be queued among a plurality of die; and an orientation mechanism to orient the die using magnetism to be positioned in a predetermined position prior to transfer to the substrate. The alignment mechanism further transports the die to be positioned at a feeding position for supply to a die transfer system.

Abstract: A tool for removing can lids having pull tabs is disclosed. The tool having an elongated member with a first end bent into a triangular-shaped handle and a second end bent into a U-shaped actuating member. Said actuating member having angles configured to receive a conventional pull tab container rim. A longitudinal portion of the tool having depressions and raised teeth configured to receive a pull tab ring therein. An object of the invention is to allow a user to easily open a can having a pull tab. Users first insert the device under the pull tab ring and pry it up. They remove and rotate the tool and reinsert it back into said pull tab ring and engage the actuating member onto the rim and also engage the teeth on said ring. They then pull up on the handle and obtain enough leverage to easily pry off the lid.

Abstract: A packaging removing tool for removing packaging material of containers having a removable cover to access the container, the packaging tool includes an elongated lever member having a first end and an opposing second end, and one or more angled portions disposed at the first end, an actuating member extending from the first end of the elongated lever member to detachably couple to the removable lid, and a handle portion extending from the second end of the elongated lever member, wherein the elongated lever member includes a pivot portion configured to removably couple to the removable cover to provide leverage when removing the packaging material.