Patents by Inventor Brian Mroczkowski

Brian Mroczkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250330090
    Abstract: Disclosed are various embodiments for controlling the switching frequency of a switching device of a power converter. Measured or computed parameters are obtained. One or more of the parameters are real-time measurements from one or more sensors. A controller selects one of the parameters as a target parameter. The target parameter is represented as an objective function that defines criteria for optimizing the objective function as minimizing, maximizing, or obtaining a particular value for the target parameter. The controller implements a machine learning algorithm to determine a selected switching frequency of the switching device that optimizes the objective function, and controls the switching device to operate at the selected switching frequency.
    Type: Application
    Filed: April 21, 2025
    Publication date: October 23, 2025
    Inventors: Andrew Tarnow, Donald J. Lucas, Carl Cody, Tristan Kuhns, Nathan Groover, Brian Mroczkowski, Gary VanMeter, William Cermak, Scott Poole
  • Publication number: 20240422945
    Abstract: Thermal interface system, and method thereof, are configured to constrain or limit an amount of compression applied to a thermal interface during insertion of an electronic device into a cage, rack, chassis, or other mounting assembly. The thermal interface system and method provide a thermal interface that is embedded within a pocket or cavity formed either on a surface of the device, a surface of the mounting assembly, or both. The thermal interface may be made of any suitable thermally conductive interface material that is resilient or has elastic properties. The pocket or cavity provides a seating for the thermal interface and operates to limit the compression or clamping force directed through the thermal interface. Such an arrangement helps prevent the full compression or clamping force used to secure the electronic device from being applied to the thermal interface.
    Type: Application
    Filed: June 13, 2024
    Publication date: December 19, 2024
    Inventors: Andrew Tarnow, Donald Lucas, Carl Cody, Tristan Kuhns, Nathan Groover, Brian Mroczkowski, Gary VanMeter, William Cermak, Scott Poole