Abstract: Thermal interface system, and method thereof, are configured to constrain or limit an amount of compression applied to a thermal interface during insertion of an electronic device into a cage, rack, chassis, or other mounting assembly. The thermal interface system and method provide a thermal interface that is embedded within a pocket or cavity formed either on a surface of the device, a surface of the mounting assembly, or both. The thermal interface may be made of any suitable thermally conductive interface material that is resilient or has elastic properties. The pocket or cavity provides a seating for the thermal interface and operates to limit the compression or clamping force directed through the thermal interface. Such an arrangement helps prevent the full compression or clamping force used to secure the electronic device from being applied to the thermal interface.