Abstract: A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Abstract: A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Abstract: A photovoltaic panel assembly including a heat sink and a plurality of photovoltaic modules mounted on the heat sink. Each photovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The photovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the photovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Abstract: A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Abstract: A photovoltaic panel assembly including a heat sink and a plurality of photovoltaic modules mounted on the heat sink. Each photovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The photovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the photovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.

Abstract: A method and system for patterning a substrate are provided. A template is formed by applying a precursor material to a patterned master substrate and curing or solidifying the precursor material. The template is detached from the master substrate using a carrier having a curved surface. The template is coated with a patterning material, and is then detached from the carrier and applied to the substrate to be patterned. The template is then dissolved without affecting the patterning material, and the patterning material may thereafter be finished to develop the pattern. In an alternate embodiment, the patterning material may be applied to the substrate and then imprinted using the template.

Abstract: A method and system for patterning a substrate are provided. A template is formed by applying a precursor material to a patterned master substrate and curing or solidifying the precursor material. The template is detached from the master substrate using a carrier having a curved surface. The template is coated with a patterning material, and is then detached from the carrier and applied to the substrate to be patterned. The template is then dissolved without affecting the patterning material, and the patterning material may thereafter be finished to develop the pattern. In an alternate embodiment, the patterning material may be applied to the substrate and then imprinted using the template.

Abstract: A method and apparatus for patterning a substrate are provided. A template is formed by applying a precursor material to a patterned master substrate and curing or solidifying the precursor material. The template is detached from the master substrate using a carrier having a curved surface. The template is coated with a patterning material, and is then detached from the carrier and applied to the substrate to be patterned. The template is then dissolved without affecting the patterning material, and the patterning material may thereafter be finished to develop the pattern. In an alternate embodiment, the patterning material may be applied to the substrate and then imprinted using the template.

Abstract: A method and apparatus for patterning a substrate are provided. A template is formed by applying a precursor material to a patterned master substrate and curing or solidifying the precursor material. The template is detached from the master substrate using a carrier having a curved surface. The template is coated with a patterning material, and is then detached from the carrier and applied to the substrate to be patterned. The template is then dissolved without affecting the patterning material, and the patterning material may thereafter be finished to develop the pattern. In an alternate embodiment, the patterning material may be applied to the substrate and then imprinted using the template.

Abstract: Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.

Abstract: Micron-scale, self-contained, ultra-high density and ultra-high speed storage devices include a read/write head and a surface, containing bit-storage domains, that acts as the storage medium. The read/write element of the memory device may consist of a single or multiple heads. The read/write head may be mounted on microelectromechanical structures driven at mechanical resonance. Addressing of individual bits is accomplished by positioning of the head element in close proximity to bit domains situated on the storage medium.

Abstract: Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.

Abstract: Nanoparticles are utilized to create, through deposition and patterning, functional electronic, electromechanical, and mechanical systems. At sizes ranging from 1 to 999 nm, the ratio of surface atoms to interior atoms becomes non-negligible, and particle properties therefore lie between those of the bulk and atomic materials. Monodisperse (i.e., uniformly sized) or polydisperse nanoparticles can form stable colloids or suspensions in appropriate dispersing media, facilitating their deposition and processing in a liquid state. As a result, printing technology can be utilized to deposit and pattern nanoparticles for mass production or for personal desktop manufacturing.

Abstract: Electrically erasable and rewritable memory structures with reversible states and good retention times may be constructed on flexible substrates using simple room-temperature deposition (e.g., printing) processes and curing temperatures below 110.degree. C. The memory structures are based on a polymer matrix having dispersed therein a particulate conductive or semiconductive material. When electrodes of suitable composition and geometry are used to apply electrical pulses of opposite polarity to the matrix material, reversible memory switching behavior is observed. In particular, subjection to positive or negative voltage pulses causes the devices to make fully-reversible transitions between low-resistance and high-resistance states.

Abstract: A system for MOCVD fabrication of superconducting and non-superconducting oxide films provides a delivery system for the feeding of metalorganic precursors for multi-component chemical vapor deposition. The delivery system can include multiple cartridges containing tightly packed precursor materials. The contents of each cartridge can be ground at a desired rate and fed together with precursor materials from other cartridges to a vaporization zone and then to a reaction zone within a deposition chamber for thin film deposition.