Patents by Inventor Brian O. Phillips

Brian O. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10221581
    Abstract: A convertible floor panel assembly incorporates a metal wire mesh subfloor and a polymer deck overlying the wire mesh subfloor. A plurality of alignment heads project from an underside of the polymer deck, and are designed to extend through respective mesh openings defined by the wire mesh subfloor. A plurality of panel retainers engage respective alignment heads, and are adapted for removably attaching the wire mesh subfloor and the polymer deck together. The floor panel assembly is thereby convertible between a substantially open-surface sound permeable safety structure and a continuous solid-surface structure for increased floor load capacity.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 5, 2019
    Inventor: Brian O. Phillips
  • Publication number: 20170226761
    Abstract: A convertible floor panel assembly incorporates a metal wire mesh subfloor and a polymer deck overlying the wire mesh subfloor. A plurality of alignment heads project from an underside of the polymer deck, and are designed to extend through respective mesh openings defined by the wire mesh subfloor. A plurality of panel retainers engage respective alignment heads, and are adapted for removably attaching the wire mesh subfloor and the polymer deck together. The floor panel assembly is thereby convertible between a substantially open-surface sound permeable safety structure and a continuous solid-surface structure for increased floor load capacity.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventor: Brian O. Phillips
  • Patent number: 9631385
    Abstract: A convertible floor panel assembly incorporates a metal wire mesh subfloor and a polymer deck overlying the wire mesh subfloor. A plurality of alignment heads project from an underside of the polymer deck, and are designed to extend through respective mesh openings defined by the wire mesh subfloor. A plurality of panel retainers engage respective alignment heads, and are adapted for removably attaching the wire mesh subfloor and the polymer deck together. The floor panel assembly is thereby convertible between a substantially open-surface sound permeable safety structure and a continuous solid-surface structure for increased floor load capacity.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: April 25, 2017
    Inventor: Brian O. Phillips