Patents by Inventor Brian Opfer

Brian Opfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Trailer coupler assemblies and related methods
    Patent number: 11701930
    Abstract: A trailer coupler assembly and methods of use are provided that includes a ball coupler, a rod member having a first end and an opposite second end, a trailer frame, a first pivot connection pivotably connecting the first end of the rod member to the ball coupler, such that the rod member can rotate within a vertical plane relative to the ball coupler, and a second pivot connection pivotably connecting the rod member to the trailer frame, such the trailer frame can rotate around the rod member. The trailer coupler assembly also includes a lock out member that is configured to releasably engage the first pivot connection to thereby restrict pivoting of the rod member relative to the ball coupler.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: July 18, 2023
    Assignee: MORRYDE INTERNATIONAL, INC.
    Inventors: David E. Heitzmann, Brian Opfer
  • TRAILER COUPLER ASSEMBLIES AND RELATED METHODS
    Publication number: 20220258549
    Abstract: A trailer coupler assembly and methods of use are provided that includes a ball coupler, a rod member having a first end and an opposite second end, a trailer frame, a first pivot connection pivotably connecting the first end of the rod member to the ball coupler, such that the rod member can rotate within a vertical plane relative to the ball coupler, and a second pivot connection pivotably connecting the rod member to the trailer frame, such the trailer frame can rotate around the rod member. The trailer coupler assembly also includes a lock out member that is configured to releasably engage the first pivot connection to thereby restrict pivoting of the rod member relative to the ball coupler.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 18, 2022
    Inventors: David E. Heitzmann, Brian Opfer