Patents by Inventor Brian Ormond

Brian Ormond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate, device and method for forming a guidance structure in the substrate, and positioning method
    Patent number: 7529449
    Abstract: A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: May 5, 2009
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Brian Ormond, Masaki Kobayashi, Toshimichi Iwamori
  • Semiconductor integrated circuit arrangement device and method
    Patent number: 7490985
    Abstract: An arrangement device including: a photography section, which photographs a first mark and a second mark in a state in which a semiconductor integrated circuit to which the first mark is applied and a member to which the second mark is applied, which member is to be used in combination with the semiconductor integrated circuit, overlap; and a movement section, which relatively moves at least one of the semiconductor integrated circuit and the member with respect to the other thereof on the basis of positions of the first mark and the second mark which have been photographed by the photography section.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: February 17, 2009
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Brian Ormond, Tomoki Umezawa
  • Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process
    Publication number: 20070222989
    Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.
    Type: Application
    Filed: May 24, 2007
    Publication date: September 27, 2007
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Brian Ormond, Toshimichi Iwamori
  • Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process
    Patent number: 7260284
    Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: August 21, 2007
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Brian Ormond, Toshimichi Iwamori
  • Semiconductor integrated circuit arrangement device and method
    Publication number: 20060211168
    Abstract: An arrangement device including: a photography section, which photographs a first mark and a second mark in a state in which a semiconductor integrated circuit to which the first mark is applied and a member to which the second mark is applied, which member is to be used in combination with the semiconductor integrated circuit, overlap; and a movement section, which relatively moves at least one of the semiconductor integrated circuit and the member with respect to the other thereof on the basis of positions of the first mark and the second mark which have been photographed by the photography section.
    Type: Application
    Filed: August 16, 2005
    Publication date: September 21, 2006
    Inventors: Brian Ormond, Tomoki Umezawa
  • Substrate, device and method for forming a guidance structure in the substrate, and positioning method
    Publication number: 20060204167
    Abstract: A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.
    Type: Application
    Filed: August 25, 2005
    Publication date: September 14, 2006
    Inventors: Brian Ormond, Masaki Kobayashi, Toshimichi Iwamori
  • Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process
    Publication number: 20060062511
    Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.
    Type: Application
    Filed: June 13, 2005
    Publication date: March 23, 2006
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Brian Ormond, Toshimichi Iwamori