Abstract: The present disclosure relates to a semiconductor package with a thermally enhanced molding compound. The disclosed semiconductor package includes a module carrier having an upper surface, a die formed over the upper surface of the module carrier, and a thermally enhanced molding compound component formed over the upper surface of module carrier to encapsulate the die. Herein, the thermally enhanced molding compound is formed from a molding compound mixed with a thermal additive and has no air pockets or voids. The thermal additive includes a number of carbon flakes or a number of carbon spherical particles. The thermal additive has a thermal conductivity larger than 450 W/m·K and an electrical resistivity larger than 90 ??.cm. In one embodiment, the thermal additive includes a number of graphene flakes, a number of graphene particles, a number of graphite flakes, or a number of graphite particles.

Abstract: The present disclosure relates to a semiconductor package with a lid that includes a lid conductive structure. The semiconductor package includes a substrate with a top surface, a lid over the top surface of the substrate, and at least one substrate-mounted component mounted on the top surface of the substrate. Herein, a cavity is defined within the lid and over the top surface of the substrate. The substrate includes a metal pad over the top surface of the substrate. The lid includes a lid conductive structure, a lid body, and a perimeter wall that extends from a perimeter of the lid body toward the top surface of the substrate. The lid conductive structure includes a body conductor that extends through a portion of the lid body and a wall conductor that is coupled to the body conductor, extends through the perimeter wall, and is electronically coupled to the metal pad.

Abstract: The present disclosure relates to a semiconductor package with a lid that includes a lid conductive structure. The semiconductor package includes a substrate with a top surface, a lid over the top surface of the substrate, and at least one substrate-mounted component mounted on the top surface of the substrate. Herein, a cavity is defined within the lid and over the top surface of the substrate. The substrate includes a metal pad over the top surface of the substrate. The lid includes a lid conductive structure, a lid body, and a perimeter wall that extends from a perimeter of the lid body toward the top surface of the substrate. The lid conductive structure includes a body conductor that extends through a portion of the lid body and a wall conductor that is coupled to the body conductor, extends through the perimeter wall, and is electronically coupled to the metal pad.