Abstract: A multipurpose medical device and a method of performing a medical procedure using the device are provided. The device can include a handle, a body, a suction system, a sensor, and an indicator. The body can be operatively coupled to the handle and can include a lumen extending through a length of the body, and at least a portion of the body is configured to operate as a retractor during the medical procedure. The suction system can include a suction channel disposed within the lumen. The sensor can be coupled to the body and can be configured to sense a retraction force against the body during the medical procedure. The indicator can be configured to provide feedback to the user based on the sensed retraction force.

Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Abstract: A biomechanical system for testing a coupled joint is provided. The coupled joint has a fixed first end and a moving second end within the testing system. The testing system includes a servo actuation system operatively connected to the moving end. The system is able to impart at least four degrees of freedom to the moving end of the coupled joint. The testing system also includes a first force sensor disposed between the servo actuation system and the moving end of the coupled joint for sensing applied load, and a second force sensor disposed at the fixed end of the coupled joint for sensing transmitted load. The system also includes a controller for selectively directing input signals to the servo actuation system in order to apply selected forces and/or motions to the moving end of the coupled joint. The coupled joint may be a cervical spine specimen.