Patents by Inventor Brian P. McGee

Brian P. McGee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220412913
    Abstract: A sensor having a distal end and an intermediate region adjacent to the distal end is provided. The sensor includes an insulator base substrate, sensor electrodes over the insulator base substrate, an electrode lead pattern over the insulator base substrate, wherein the electrode lead pattern includes electrode leads configured for contact with the sensor electrodes, and wherein the electrode leads extend completely across the intermediate region in a longitudinal direction, and a structural backing layer over the electrode lead pattern and insulator base substrate; wherein a side edge of the structural backing layer over the electrode lead pattern extends completely across the structural backing layer in the longitudinal direction.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Inventors: Christina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones, Hsiu-Hsin Chung, Nathan Hobbs, Jorge L. Nieto, Anirban Chakraborty
  • Patent number: 11448611
    Abstract: Sensors and methods for manufacturing sensors are provided. An exemplary method for manufacturing a sensor includes forming an electrode lead pattern over an insulator base substrate. Further, the method includes forming a structural backing layer over the electrode lead pattern and insulator base substrate. Also, the method includes performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: September 20, 2022
    Assignee: Medtronic MiniMed, Inc.
    Inventors: Christina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones, Hsiu-Hsin Chung, Nathan Hobbs, Jorge L. Nieto, Anirban Chakraborty
  • Publication number: 20210003526
    Abstract: Sensors and methods for manufacturing sensors are provided. An exemplary method for manufacturing a sensor includes forming an electrode lead pattern over an insulator base substrate. Further, the method includes forming a structural backing layer over the electrode lead pattern and insulator base substrate. Also, the method includes performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 7, 2021
    Inventors: Christina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones, Hsiu-Hsin Chung, Nathan Hobbs, Jorge L. Nieto, Anirban Chakraborty
  • Patent number: 5207043
    Abstract: A masonry connector for connecting a structural steel stud and an external wythe of masonry units through interposed insulation is provided. The connector includes a substantially "L"-shaped clip, a high profile threaded screw, a first washer, and a tie wire. The "L"-shaped clip has a vertical arm for connection to the structural steel stud and a horizontal arm extending outwardly from the structural steel stud substantially at right angles to the vertical arm. The vertical arm has a first opening for insertion of the high profile threaded screw. The horizontal arm has a second opening, outwardly of the insulation when the insulation is installed for insertion of a tie wire. The high profile threaded screw is inserted through the first opening in the vertical arm of the clip and drilled through the structural steel stud. The first washer is mounted on the horizontal arm outwardly of the insulation for securing the insulation against the structural steel stud.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: May 4, 1993
    Inventors: Brian P. McGee, Frank Rocca