Abstract: An electrically heatable activated carbon body and method of making and using the body. The body is composed of a non-metallic monolithic structure having activated carbon and means for passage of a workstream therethrough; the device is adapted for conducting an electric current therethrough. The body is used in adsorption and desorption applications wherein an electric current is passed through the structure having adsorbed species, to raise the temperature above the desorption temperature of the adsorbed species, to cause desorption of the adsorbed species which then pass out of the structure. The body is preferably an activated carbon coated honeycomb which is fitted with a conducting metal.

Abstract: This invention is directed to the preparation of glasses in the PbO--Ga.sub.2 O.sub.3 field exhibiting good infrared transmitting characteristics out to wavelengths of 8 microns. The binary glasses consist essentially, by weight, of about 15-28% Ga.sub.2 O.sub.3 and 72-85% PbO. However, the preferred glasses contain up to 85% Bi.sub.2 O.sub.3 and consist essentially as included within the area generally encompassed by the curve in FIG. 2.

Abstract: This invention is concerned with the production of glasses in the Bi.sub.2 O.sub.3 --Ga.sub.2 O.sub.3 system with, preferably, CdO which exhibit high indices of refraction and infrared transmitting capabilities to wavelengths of about 8 microns. The broadest scope of operable glasses involves, in weight percent, about______________________________________ Bi.sub.2 O.sub.3 40-90 Ga.sub.2 O.sub.3 5-30 CdO 0-35 ______________________________________with the preferred glasses consisting essentially of about ______________________________________ Bi.sub.2 O.sub.3 55-85 Ga.sub.2 O.sub.

Abstract: This invention relates to sealing mixtures consisting essentially of a sealing glass having a low sealing temperature and a high coefficient of thermal expansion, and a glass-ceramic additive that imparts a lower effective coefficient of expansion to the sealing mixture with a minimum effect on glass flow at the sealing temperature. It further concerns the use of this mixture to produce fusion seals between elements, particularly elements in electrical and electronic components.