Patents by Inventor Brian Paquette

Brian Paquette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated process condition sensing wafer and data analysis system
    Patent number: 7855549
    Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 21, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: Wayne Glenn Renken, Earl M. Jensen, Roy Gordon, Brian Paquette, Mei H. Sun
  • Integrated Process Condition Sensing Wafer and Data Analysis System
    Publication number: 20070046284
    Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
    Type: Application
    Filed: October 27, 2006
    Publication date: March 1, 2007
    Applicant: SensArray Corporation
    Inventors: Wayne Renken, Earl Jensen, Roy Gordon, Brian Paquette, Mei Sun
  • Integrated process condition sensing wafer and data analysis system
    Patent number: 7135852
    Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: November 14, 2006
    Assignee: SensArray Corporation
    Inventors: Wayne Glenn Renken, Earl M. Jensen, Roy Gordon, Brian Paquette, Mei H. Sun
  • Integrated process condition sensing wafer and data analysis system
    Publication number: 20040225462
    Abstract: A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
    Type: Application
    Filed: April 29, 2004
    Publication date: November 11, 2004
    Inventors: Wayne Glenn Renken, Earl M. Jensen, Roy Gordon, Brian Paquette, Mei H. Sun