Abstract: Described are techniques for corroborating anomalous behavior. The techniques include training devices included in an Internet of Things (IoT) mesh network to independently identify occurrences of anomalous behavior in a proximate physical environment. The techniques further include receiving event data from at least a portion of the devices in the IoT mesh network corresponding to a time window, where the event data reports occurrences of at least one type of anomalous behavior. The techniques further include corroborating the at least one type of anomalous behavior to determine that the occurrences of the at least one type of anomalous behavior indicate an anomalous event that meets a reporting threshold for providing notice of the anomalous event. The techniques further include generating a notification regarding the anomalous event.

Abstract: A meeting management method, system, and non-transitory computer readable medium, include a target determination circuit configured to determine a target of an agenda for a meeting, the target of the agenda including which users correspond to a topic, a behavior capturing circuit configured to capture behavior of the users during the meeting, a tracking and identifying circuit configured to track the behavior of the users during the meeting and identify a user of the users corresponding to the behavior, and a difference determination circuit configured to determine if a difference between the behavior of the users and the target of the agenda is greater than a threshold value.

Abstract: A meeting management method, system, and non-transitory computer readable medium, include a target determination circuit configured to determine a target of an agenda for a meeting, the target of the agenda including which users correspond to a topic, a behavior capturing circuit configured to capture behavior of the users during the meeting, a tracking and identifying circuit configured to track the behavior of the users during the meeting and identify a user of the users corresponding to the behavior, and a difference determination circuit configured to determine if a difference between the behavior of the users and the target of the agenda is greater than a threshold value.

Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

Abstract: Improved feed line networks for antenna arrays operating at millimeter wave frequencies are provided for constructing planar antenna arrays printed on the surface of a dielectric substrate. A planar antenna array includes an array of planar radiator elements interconnected through a feed line network of planar coplanar transmission lines that enable high-efficiency operation, at millimeter wave operating frequencies. For example, a feed network may be formed with a network of coplanar strip line transmission lines including one or more coplanar strip line (CPS) and one or more coplanar waveguide (CPW) transmission line, which are interconnected using balun structures, to enable high efficiency operation at millimeter wave frequencies.

Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.

Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

Abstract: Improved feed line networks for antenna arrays operating at millimeter wave frequencies are provided for constructing planar antenna arrays printed on the surface of a dielectric substrate. A planar antenna array includes an array of planar radiator elements interconnected through a feed line network of planar coplanar transmission lines that enable high-efficiency operation, at millimeter wave operating frequencies. For example, a feed network may be formed with a network of coplanar strip line transmission lines including one or more coplanar strip line (CPS) and one or more coplanar waveguide (CPW) transmission line, which are interconnected using balun structures, to enable high efficiency operation at millimeter wave frequencies.

Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: Antenna devices are provided comprising antenna structures encapsulated or molded into plastic covers of computing devices to enable wireless communication. For example, one or more antenna structures can be encasulated within, or molded into, a plastic display cover of a portable laptop computer. Embedded antenna designs can include various antenna types that are built using one or more wires or thin metallic strips encapsulated into plastic device covers. Insert/injection molding methods can be used to encapsulate antenna structures in plastic device covers during fabrication of the plastic device covers.

Abstract: Low-profile, compact embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over a desired bandwidth of operation. Compact antenna designs with reduced antenna size (e.g., antenna height) and increased operational bandwidth (e.g., broadband impedance matching) are achieved using slotted ground plane designs and/or doubling antenna feeding schemes.

Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.

Abstract: Low-profile, compact UWB embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over an operating bandwidth of about 1 GHz to about 11 GHz.

Abstract: Multiband antennas are provided that can be embedded in computing devices such as portable laptop computers and cellular phones, for example, to provide efficient wireless communication in multiple frequency bands. For example, monopole multiband antennas, dipole multiband antennas, and inverted-F antennas are provided, which include one or more coupled and/or branch radiating elements, for providing multiband operation in two or more frequency bands.

Abstract: Integrated (embedded) tri-band antennas for use with portable devices such as laptop computers. In one aspect, an integrated tri-band antenna for a portable device comprises a first element having a resonant frequency in a first frequency band, a second element having a resonant frequency in a second frequency band, a third element having a resonant frequency in a third frequency band, and a ground element for grounding the first, second and third elements. The first, second and third elements and ground element may be metallic elements formed on a PCB (printed circuit board), wherein the first element is connected to a signal feed, and wherein the PCB is mounted to a metallic support frame of a display unit of the portable device.