Patents by Inventor Brian Philofsky

Brian Philofsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11373929
    Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: June 28, 2022
    Assignee: XILINX, INC.
    Inventors: Gamal Refai-Ahmed, Chi-Yi Chao, Suresh Ramalingam, Hoa Lap Do, Anthony Torza, Brian Philofsky, Arun Kumar Varadarajan Rajagopal