Abstract: It has been found that composition containing copper, tin, and silver prevents tin whisker formation on an electronic structure while allowing solders to wet such structures during soldering processes. It has further been found that conventional techniques, such as electrolytic plating, electroless plating, wet dipping and vapor deposition, for forming such materials have undesirable limitations and/or characteristics. However, by forming a Ag/Sn precursor on a copper containing electronic structure and inducing a self-limiting reaction between the precursor and the copper of the structure, the advantageous Ag/Sn/Cu material is formed without the undesirable limitations and characteristics associated with conventional techniques.

Abstract: The electrical and mechanical properties of structures such as lead frames and other electrical/electronic devices containing, during processing, copper/tin interfaces are improved by introduction of nickel to such interface. Typically, a weight percentage of nickel to tin in the range 1 to 12 weight percent yields upon melting of the tin, an intermetallic compound with essentially no occluded, unbound tin. Thus undesirable anomalous structures such as tin needles and substantially non-planar interface compositions are avoided. Advantageously a nickel/tin/copper intermetallic interface that is substantially planar is formed in the substantial absence of needle-like tin structures.

Abstract: A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.