Abstract: A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F?) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.

Abstract: A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F?) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.

Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.

Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.