Patents by Inventor Brian R. Bielick

Brian R. Bielick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical circuit apparatus and methods for assembling same
    Patent number: 7070084
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: July 4, 2006
    Assignee: Motorola, Inc.
    Inventors: John M. Waldvogel, Brian R. Bielick, Herman J. Miller, Billy J. Van Cannon
  • Electrical circuit apparatus and method
    Patent number: 7063249
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: June 20, 2006
    Assignee: Motorola, Inc.
    Inventors: John M. Waldvogel, Brian R. Bielick, Herman J. Miller, Billy J. Van Cannon
  • Electrical circuit apparatus and methods for assembling same
    Patent number: 6861746
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 1, 2005
    Assignee: Motorola, Inc.
    Inventors: John M. Waldvogel, Brian R. Bielick, Herman J. Miller, Billy J. Van Cannon
  • Electrical circuit apparatus and method for assembling same
    Patent number: 6842341
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: January 11, 2005
    Assignee: Motorola, Inc.
    Inventors: John M. Waldvogel, Brian R. Bielick, Herman J. Miller, Billy J. Van Cannon