Patents by Inventor Brian R. Burwick

Brian R. Burwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100285697
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: July 21, 2010
    Publication date: November 11, 2010
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20090017700
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 15, 2009
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7472505
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: January 6, 2009
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7309262
    Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: December 18, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Andrew J. Ries, Brian R. Burwick, John E. Nicholson, Jay K. Lahti, Gregory A. Theis
  • Patent number: 7175482
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: February 13, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 6817905
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: November 16, 2004
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20030069612
    Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.
    Type: Application
    Filed: June 20, 2001
    Publication date: April 10, 2003
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 6080188
    Abstract: A connector for clamping lead bodies into connector bores in implantable medical devices has several alternative embodiments. In each there is a handle that has a fixed relationship with an axle member that connects through the connector block perpendicular to the long axes of the connector bores for the leads. A large, manually operable flag or handle member clicks into position to lock the lead in by positioning a saddle portion against the lead body in the bore. The handle may be split into legs or the axle may be split into legs and the space between the legs filled with medical adhesive if desired. Likewise a soft material elastomer may surround the saddle portion to prevent rough contact with the lead body.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: June 27, 2000
    Assignee: Medtronic, Inc.
    Inventors: George J. Rowley, Gary M. Grose, Brian R. Burwick, Mitchell R. MacIver, Jane M DeMay