Patents by Inventor Brian R. Dorvel

Brian R. Dorvel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240207795
    Abstract: An aqueous solvent composition (or separation fluid composition) including an aqueous mixture of (a) a solvent and (b) water for swelling, degrading, and/or fully dissolving adhesives; wherein the molecular weight of the solvent in the aqueous mixture is less than 1,000 g/mol; wherein the Hansen Solubility parameters of the solvent are in the following ranges: (i) a dispersive component from 15 MPa1/2 to 21 MPa1/2; (ii) a polar component from 3 MPa1/2 to 10.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 27, 2024
    Inventors: Jillian A. Emerson, Scott T. Matteucci, Brian R. Dorvel, Vikram Prasad, Manesh Nadupparambil Sekharan, Christopher J. Tucker, Craig F. Gorin, Amira A. Marine
  • Publication number: 20230399480
    Abstract: According to various embodiments, a microcellular foam is provided, wherein the microcellular foam comprises a polymer blend, the polymer blend comprising: from 70 to 95% by weight low density polyethylene (LDPE); and from 5 to 30% by weight of polydimethylsiloxane grafted LDPE (PDMS-g-LDPE), wherein the microcellular foam has an average cell size of less than 60 ?m.
    Type: Application
    Filed: October 29, 2021
    Publication date: December 14, 2023
    Applicant: Dow Global Technologies LLC
    Inventors: Brian R. Dorvel, Andrew T. Heitsch, Anson Sze Tat Wong, Stéphane Costeux, John O. Osby, Jian Yang