Patents by Inventor Brian R. Harkness

Brian R. Harkness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10473822
    Abstract: An optical element comprises an antireflective layer that is disposed on and in contact with a substrate. The antireflective layer has a refractive index of greater than 1 to less than 1.41 and has a pore size ranging from greater than 0 to less than 300 nm. The antireflective layer includes an outermost surface having a water contact angle ranging from greater than or equal to 70° to less than or equal to 120° as determined using ASTM 5946-04.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: November 12, 2019
    Assignee: Dow Silicones Corporation
    Inventors: Fengqiu Fan, Brian R. Harkness, Jr., Junying Liu, Wei Rong, Takeaki Tsuda, Michael L. Bradford
  • Publication number: 20160363698
    Abstract: An optical element comprises an antireflective layer that is disposed on and in contact with a substrate. The antireflective layer has a refractive index of greater than 1 to less than 1.41 and has a pore size ranging from greater than 0 to less than 300 nm. The antireflective layer includes an outermost surface having a water contact angle ranging from greater than or equal to 70° to less than or equal to 120° as determined using ASTM 5946-04.
    Type: Application
    Filed: April 7, 2015
    Publication date: December 15, 2016
    Applicant: Dow Corning Corporation
    Inventors: FENGQIU FAN, BRIAN R. HARKNESS, Jr., JUNYING LIU, WEI RONG, TAKEAKI TSUDA, MICHAEL L. BRADFORD
  • Publication number: 20140291872
    Abstract: A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.
    Type: Application
    Filed: October 5, 2012
    Publication date: October 2, 2014
    Inventors: Brian R. Harkness, Malinda N. Howell, Daesup Hyun, Jing Jiang, John J. Kennan, Kent R. Larson, Randall G. Schmidt, Shengqing Xu
  • Publication number: 20140008697
    Abstract: A composition includes an organopolysiloxane component (A) comprising at least one of a disiloxane, a trisiloxane, and a tetrasiloxane, and has an average of at least two alkenyl groups per molecule. The composition further includes an organohydrogensiloxane component (B) having an average of at least two silicon-bonded hydrogen atoms per molecule. Components (A) and (B) each independently have at least one of an alkyl group and an aryl group and each independently have a number average molecular weight less than or equal to 1500 (g/mole). The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C), and titanium dioxide (TiO2) nanoparticles (D). The composition has a molar ratio of alkyl groups to aryl groups ranging from 1:0.25 to 1:3.0. A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.
    Type: Application
    Filed: December 6, 2011
    Publication date: January 9, 2014
    Inventors: Brian R. Harkness, Ann W. Norris, Shellene K. Thurston, Vishal Chhabra, Bharati S. Kulkarni, Nikhil R. Taskar
  • Publication number: 20130256741
    Abstract: A composition of the present invention includes an organopolysiloxane component (A) comprising at least one of a disiloxane, a trisiloxane, and a tetrasiloxane, and has at least one of an alkyl group and an aryl group and has an average of at least two alkenyl groups per molecule. Component (A) has a number average molecular weight less than or equal to 1500 (g/mole). The composition further includes an organohydrogensiloxane component (B) having at least one of an alkyl group and an aryl group and having an average of at least two silicon-bonded hydrogen atoms per molecule. Component (B) has a number average molecular weight less than or equal to 1500 (g/mole). The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C). A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.
    Type: Application
    Filed: December 6, 2011
    Publication date: October 3, 2013
    Inventors: Brian R. Harkness, Ann W. Norris, Shellene K. Thurston
  • Publication number: 20130256742
    Abstract: A composition includes an organopolysiloxane component (A) having at least one aryl group and having an average of at least two alkenyl groups per molecule. The composition further includes an organohydrogensiloxane component (B) having at least one of an alkyl group and an aryl group and an average of at least two silicon-bonded hydrogen atoms per molecule. Components (A) and (B) each independently have a number average molecular weight less than or equal to 1500 (g/mole). The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C), and metal-oxide nanoparticles (D) other than titanium dioxide (TiO2) nanoparticles. The composition has a molar ratio of alkyl groups to aryl groups ranging from 1:0.25 to 1:3.0. A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.
    Type: Application
    Filed: December 6, 2011
    Publication date: October 3, 2013
    Applicant: Dow Corning Corporation
    Inventors: Brian R. Harkness, Ann W. Norris, Shellene K. Thurston, Masaaki Amako, Maki Itoh, Michitaka Suto
  • Patent number: 6737117
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: May 18, 2004
    Assignee: Dow Corning Corporation
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong
  • Publication number: 20030191267
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Application
    Filed: April 5, 2002
    Publication date: October 9, 2003
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong
  • Patent number: 6258506
    Abstract: The instant invention pertains to a curable composition comprising (a) substance that generates free radicals under the action of ultraviolet radiation and (b) polymer molecule bearing functionality capable of polymerization under the action of said free radicals wherein (a) is a benzoin ether and makes up from 0.001 to 10 wt % of the total composition and (b) has the following formula (R3SiO1/2)a(R′2SiO2/2)b(R″SiO3/2)c(SiO4/2)d in which R, R′, and R″ are each H or C1 to C10 hydrocarbyl possibly containing a heteroatom and at least 10 % is, for example, a vinyl group, and a+b+c+d=1. The composition of the instant invention is a storage-stable UV-curable composition that does not suffer from cure inhibition by air or oxygen, that is very efficiently cured by low doses of UV radiation, and provides a highly heat-resistant cured pattern by heating after pattern formation.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: July 10, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6096483
    Abstract: The present invention provides a curable composition which comprises (A) a base-generating substance which generates a base when exposed to the action of ultraviolet light, (B) a siloxane polymer which has silicon-hydrogen bonds (Si--H) capable of reacting with hydroxy groups under the effect of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules (H.sub.2), and (C) an acid substance. This composition is cured by irradiation with ultraviolet light. During this ultraviolet irradiation, a mask is placed between a coating film of the composition and the radiation source, and the uncured portions of the composition are dissolved and removed so that a pattern is formed. The residual portions are then heated to produce a pattern-cured product.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: August 1, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6051625
    Abstract: The instant invention pertains to a curable composition comprising(a) substance that generates free radicals under the action of ultraviolet radiation and(b) polymer molecule bearing functionality capable of polymerization under the action of said free radicals wherein (a) is a benzoin ether and makes up from 0.001 to 10 wt % of the total composition and (b) has the following formula(R.sub.3 SiO.sub.1/2).sub.a (R'.sub.2 SiO.sub.2/2).sub.b (R"SiO.sub.3/2).sub.c (SiO.sub.4/2).sub.din which R, R', and R" are each H or C.sub.1 to C.sub.10 hydrocarbyl possibly containing a heteroatom and at least 10% is, for example, a vinyl group, and a+b+c+d=1. The composition of the instant invention is a storage-stable UV-curable composition that does not suffer from cure inhibition by air or oxygen, that is very efficiently cured by low doses of UV radiation, and provides a highly heat-resistant cured pattern by heating after pattern formation.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: April 18, 2000
    Assignee: Dow Corning Asia, LTD.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 5908660
    Abstract: A method for the preparation of hydrophobic precipitated silicas which are useful, for example, as reinforcing fillers in rubber compositions. The method comprises two steps, where in the first step an aqueous suspension of precipitated silica is contacted with an organosilicon compound in the presence of a catalytic amount of an acid to effect hydrophobing of the precipitated silica. In the second step the aqueous suspension of the hydrophobic precipitated silica is contacted with a water-immiscible organic solvent at a solvent to silica weight ratio greater than 5:1 to effect separation of the hydrophobic precipitated silica from the aqueous phase.
    Type: Grant
    Filed: September 3, 1997
    Date of Patent: June 1, 1999
    Assignee: Dow Corning Corporation
    Inventors: Phillip J. Griffith, Brian R. Harkness, William Herron, Rosemary M. Taylor, David J. Wilson
  • Patent number: 5861235
    Abstract: This invention pertains to a curable composition comprising a N-substituted 4-(o-nitrophenyl)dihydropyridine (a compound that generates base under the action of ultraviolet radiation) and a silanol-containing polymer that condenses under the action of the base generated to form a siloxane bond. The compositions of the instant invention cure by exposure to ultraviolet radiation. Cured patterns may be formed from the curable composition by interposing a mask between a film of the said composition and the radiation source during UV exposure, then dissolving and removing the uncured composition to form a pattern, and thereafter heating the residual material. The compositions can be cured by low-strength ultraviolet radiation and produce a highly heat-resistant cured product.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: January 19, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 5820944
    Abstract: The present invention pertains to a curable composition which comprises a) a N-substituted 4-(o-nitrophenyl)dihydropyridine which constitutes a base-generating substance that is caused to generate a base by the action of ultraviolet light, and (b) a silicone polymer (R.sub.2 SiO.sub.2/2)(RSiO.sub.3/2) containing silicon-hydrogen bonds (Si--H) which are capable of reacting with hydroxy groups to form silicon-oxygen bonds (Si--O) and hydrogen molecules (H.sub.2) under the effect of the base. This composition is cured by irradiation with ultraviolet light. Patterns are formed by placing a mask between a coating film of the composition and the ultraviolet light source during the irradiation with ultraviolet light, and then dissolving and removing the uncured portions of the composition following said irradiation.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: October 13, 1998
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 5614603
    Abstract: The introduction of a highly spin-coatable silicone resin that does not produce large amounts of volatiles during its cure, and that is a precursor to highly heat-resistant, optically transparent cured products that exhibit an excellent hardness. The silicone resin comprises a silicone polymer of the general formula:(Ph.sub.2 SiO).sub.a (HSiO.sub.3/2).sub.b (R.sup.1 SiO.sub.3/2).sub.cin which R.sup.1 is hydrogen or C.sub.1 to C.sub.8 hydrocarbon group, possibly containing a heteroatom, Ph is a phenyl group and 6.ltoreq.a+b+c.ltoreq.1,000, 0.6>a/(a+b+c).gtoreq.0.4, and 1.0.gtoreq.b/(b+c).gtoreq.0.2.
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: March 25, 1997
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takeuchi
  • Patent number: 5516871
    Abstract: There is disclosed a diphenylsiloxane oligomer functionalized at both terminals and methods for the preparation thereof, said oligomer having the following general formulaG-(OSiPh.sub.2).sub.m O-G (i)wherein Ph denotes a phenyl radical, m is 3 to 50 and G has a formula independently selected from the group consisting of ##STR1## in which R, R.sup.4 and R.sup.5 are independently selected from the group consisting of methyl, phenyl and R.sup.1, R.sup.1 is selected from the group consisting of hydrogen and a monovalent hydrocarbon group having 2 to 8 carbon atoms excluding phenyl, tolyl, xylyl, and ethylphenyl radicals, Q is a divalent hydrocarbon group and k is independently 0 to 3 at each terminus of said oligomer with the proviso that k is >0 at one terminus of said oligomer, at least one substituent among R, R.sup.4 and R.sup.5 in formula (ii) is R.sup.1 and, when both R.sup.4 and R.sup.5 groups at one terminus of said oligomer are phenyl, groups R.sup.4 and R.sup.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: May 14, 1996
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa
  • Patent number: 5502229
    Abstract: There is disclosed a diphenylsiloxane oligomer functionalized at both terminals, and methods for the preparation thereof, said oligomer having the following general formula G-(OSi(Ph).sub.2).sub.m O--G wherein Ph denotes a phenyl radical, m is 3 to 50 and G is has a formula independently selected from the group consisting of ##STR1## in which R.sup.1 is independently selected from the group consisting of hydrogen and a monovalent hydrocarbon group having 2 to 8 carbon atoms, said monovalent hydrocarbon group excluding phenyl, tolyl, xylyl, and ethylphenyl radicals, R is independently selected from the group consisting of R.sup.1, methyl radical and phenyl radical, Q is a divalent hydrocarbon group and n is an integer having a value of 1 to 3.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: March 26, 1996
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takeuchi