Abstract: A broadband communication system having a first broadband communication ground station, a second broadband communication ground station, and a satellite constellation. The satellite constellation is used for conducting bi-direction broadband communication between the first broadband communication ground station and the second broadband communication ground station. At least one satellite of the satellite constellation has an inclined eccentric orbit in a first orbit plane. The satellite constellation is disposed in orbit so that when observed from a predetermined ground observation point a number of satellites, including the at least one satellite, in the constellation appear to follow a substantially common path which extends through a predetermined active zone. The number of satellites moving along the common path is such that the predetermined active zone has one satellite from the number of satellites continuously located therein.

Abstract: A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36).

Abstract: A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36).

Abstract: A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26).

Abstract: The output terminals (15, 16) of an analog sensor (14) are monitored by a microprocessor (17). The microprocessor is DC coupled to a main analog ground terminal (16) of the sensor, while also separately being connected to a main power ground terminal (13) at which ground reference potential is provided to the microprocessor. A resistor (38), a semiconductor switch (36) and a printed circuit board metalization trace (35) provide a normal low resistance connection between the main analog sensor ground terminals (20) and the main power ground terminal (13). Current sensing circuitry (33) limits the current passed through the low resistance connection and thereby prevents excessive current from damaging printed circuit board metalization paths (34, 35) connecting the sensor analog ground terminal (16) to the main power ground terminal (13).