Patents by Inventor Brian R. MINIX

Brian R. MINIX has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945977
    Abstract: A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 2, 2024
    Assignee: Bostik, Inc.
    Inventors: Steven D. Gray, Darius K. Deak, Brian R. Minix, Edward P. Tomlinson
  • Publication number: 20220325145
    Abstract: A hot melt adhesive uses a blend of polymers having controlled stereoerror and comprises a stereoblock polypropylene comprising a first block having an isotactic index of between about 50% and about 95% and a second block having an isotactic index of between about 5% and 50%, wherein the difference between the isotactic indeces of the first block and the second block is at least about 10%. The hot melt adhesive exhibits improved peel and tack properties without compromising shear strength and vice versa.
    Type: Application
    Filed: July 30, 2020
    Publication date: October 13, 2022
    Inventors: Brian R. Minix, Steven D. Gray, Miao Hu, Kimberly E. Secrist
  • Publication number: 20200010743
    Abstract: A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
    Type: Application
    Filed: February 20, 2018
    Publication date: January 9, 2020
    Inventors: Steven D. GRAY, Darius K. DEAK, Brian R. MINIX, Edward P. TOMLINSON