Abstract: A composition comprises a perfluorinated solvent having at least one CF3 group selected from a perfluoropolyether solvent having a boiling point temperature of at least 120° C. at atmospheric pressure and a nitrogen-containing perfluorinated solvent. The composition further comprises a polyfluoropolyether silane. The composition forms layers having excellent physical properties, including durability and appearance, in addition to stain and smudge resistance.

Abstract: A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.

Abstract: A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.

Abstract: A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.

Abstract: A method for preparing a patterned feature includes the steps of I) casting a curable silicone composition against a master, II) curing the curable silicone composition to form a silicone mold, II) separating the master and the silicone mold, IV) filling a silicone mold having a patterned surface with a curable epoxy formulation; V) curing the curable epoxy formulation to form a patterned feature; VI) separating the silicone mold and the patterned feature; optionally VIII) etching the patterned feature; optionally IX) cleaning the silicone mold; and optionally X) repeating steps IV) to IX) reusing the silicone mold.

Abstract: A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.

Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO(3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

Abstract: A method for the preparation of hydrophobic fumed silicas which are useful, for example, as reinforcing fillers in rubber compositions. The method comprises two steps, where in the first step an aqueous suspension of fumed silica is contacted with an organosilicon compound in the presence of a catalytic amount of an acid to effect hydrophobing of the fumed silica. In the preferred method the first step is conducted in the presence of a water miscible organic solvent which facilitates hydrophobing of the fumed silica with the organosilicon compound and the fumed silica has a BET surface area greater than 50 m.sup.2 /g. In the second step the aqueous suspension of the fumed silica is contacted with a water-immiscible organic solvent at a solvent to silica weight ratio greater than 0.1:1 to effect separation of the hydrophobic fumed silica from the aqueous phase. In a preferred process the hydrophobic fumed silica has a surface area within a range of about 100 m.sup.2 /g to 750 m.sup.2 /g.

Abstract: Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.

Abstract: A curable polysiloxane of formulaA.sub.a B.sub.b (R.sub.3 SiO.sub.0.5).sub.c (R.sub.2 SiO).sub.d (RSiO.sub.1.5).sub.e (SiO.sub.2).sub.fwhere A and B are silacyclobutane, disilacyclobutane or benzosilacyclobutene functional groups. A composition of matter comprising this polysiloxane and a copper, silver or gold containing catalyst. A method of curing this polysiloxane.

Abstract: Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.