Abstract: An integrated device package includes a substrate and a die coupled to the substrate. The integrated device package also includes a thermal interface material coupled to the die, and a lid coupled to the substrate and to the thermal interface material. The lid includes a unitary body that includes one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.

Abstract: Aspects disclosed include an integrated circuit (IC) package comprising a substrate and a solder joint coupled to a corner interconnect structure of the substrate to improve the reliability of the package. Related apparatus and methods are also disclosed. The substrate includes the corner interconnect structure in a corner of the substrate. The corner interconnect structure includes a first metal interconnect adjacent to the corner of the substrate and a plurality of second metal interconnects adjacent to the first metal interconnect. The IC package includes a solder joint coupled to at least two of the metal interconnects in the corner interconnect structure improving the mechanical reliability of the IC package. In so doing, a plurality of third metal interconnects adjacent to the corner interconnect structure may be utilized for input/output (I/O) communication paths increasing the input/output of the IC package without growing the size of the package.

Abstract: A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.

Abstract: A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.