Abstract: Components and materials, including thermal transfer materials, described herein comprise at least one heat spreader component coupled with a metal-based coating, layer and/or film, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of at least one of the surfaces of the heat spreader component.

Abstract: Thermal interface materials are described herein that include at least one phase change material, and at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material. Methods of producing thermal interface materials are also described that include providing at least one phase change material; providing at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material; and physically coupling the at least one phase change material and the at least one solvent, solvent mixture or combination thereof.

Abstract: A thermally conductive material that includes an alloy which includes indium, zinc, magnesium or a combination thereof is described herein. Also, a semiconductor package comprising a thermal interface material which includes solder and particles dispersed throughout the solder, the particles being of thermal conductivity greater than or equal to about 80 W/m-K is described herein. In one described embodiment, a semiconductor package includes a thermal interface material which includes at least one lanthanide element. In yet another embodiment disclosed herein, a solder preform construction includes a solder and a structure within the solder, the solder being of a first composition and the structure being of a second composition which has a lower melting point than the first composition.