Patents by Inventor Brian Rychcik

Brian Rychcik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130081437
    Abstract: A rolling mill coil-forming laying head system elongated hollow pathway Or pipe structure defining an inner surface for transport of elongated materials is formed by the process of bending the pathway structure at near constant temperature, such as at near ambient temperature, preferably without application of external heat. In some embodiments, the method utilizes an automated bending machine, preferably under computer numerical control (CNC) that executes stored bending constructions to conform the pathway structure to a desired profile. The bending instructions may be modified so that the actual bending profile conforms to a desired profile. In this manner subsequent path structures may be formed, that have uniform physical properties.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 4, 2013
    Applicant: SIEMENS INDUSTRY, INC.
    Inventors: Daniel Kilcoyne, Jianping Zhang, David Abdelmaseh, Brian Rychcik