Abstract: The invention relates to a laminating adhesive including a reaction product of at least one polymeric polyol (part A) and at least one NCO terminated polyurethane prepolymer (part B). The part A includes a reaction product of at least one alkylene diol; at least one dial containing a pendant aliphatic chain; and at least one dicarboxylic acid. The part B includes a reaction product of at least one polyether polyol; and at least one polyisocyanate. The adhesive exhibits an initial viscosity of less than about 25,000 mPa.s at about 25° C.

Abstract: Improved isocyanate-based formulations which are useful laminating adhesives for flexible packaging. The low viscosity formulations have enhanced processing characteristics at reduced temperatures.

Abstract: The invention relate to a method of laminating flexible packaging, articles of manufacture and bonded laminates. The method comprises employing a laminating adhesive comprising an isocyanate-based composition comprising the reaction product of at least one polymeric polyol (part A) comprising the reaction product of at least one alkylene diol at least one diol; containing a pendant aliphatic chain; and at least one dicarboxylic acid; with at least one NCO terminated polyurethane prepolymer (part B) comprising the reaction product of at least one polyether polyol; and at least one polyisocyanate. The low viscosity laminating adhesive has enhanced processing characteristics at reduced temperature.

Abstract: A sealant for use at temperatures greater than about 700.degree. F. may be formed from:(a) about 40 to 90 wt-% of a silicone having a molecular weight of about 10,000 to 10,000,000 and repeating units comprising:(i) about 1 to 20 mole-% of units having the formula: ##STR1## wherein R comprises --H, a C.sub.1-5 alkyl group, a C.sub.1-5 fluoroalkyl group, a vinyl group or a phenyl group and(ii) about 99 to 80 mole-% of units having the formula: ##STR2## wherein each R independently comprises --H, a C.sub.1-5 alkyl group, a C.sub.1-5 fluoroalkyl group, a vinyl group, or a phenyl group; and(b) about 1 to 10 wt-% of a thermal stabilizer;(c) about 0.1 to 2 wt-% of a curing agent; and(d) about 0 to 50 wt-% of an inorganic filler;wherein the composition remains an effective sealant at temperatures above about 700.degree. F. The sealant may be used to bond and seal a barrier film or vacuum bag to a forming tool in autoclave curing and processing of thermosetting and thermoplastic composites.