Abstract: Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.

Abstract: Embodiments may relate a computing device with a heat source. The computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source. Other embodiments may be described or claimed.

Abstract: Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate. The heat exchanger puck may further include a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate. Other embodiments may be described and/or claimed.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: A method and apparatus to manage airflow in a chassis includes one or more airflow restrictor assemblies disposed adjacent a slot within the chassis. The airflow restrictor assemblies can be set in a plurality of positions between a minimum airflow position and a maximum airflow position. The position of the airflow restrictor assembly can be set in accordance with characteristics of the module inserted in the slot. The module characteristics may include power dissipation and airflow resistance.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: A power supply includes a power cable interface. The power supply also includes an interface guard. The interface guard has an unlocked position and a locked position. When the interface guard is in the unlocked position, the power supply can be attached and detached from a chassis of an electrical system. When the interface guard is in the locked position, the power supply cannot be attached or detached from the chassis of the electrical system. The power cord can only be attached to the power supply while the interface guard is in the locked position.

Abstract: A flexible chassis for a computer system that is adapted to receive computer components of different sizes and configurations. The flexible chassis includes a printed circuit board (PCB) mounting plate that is adapted to receive baseboards of different sizes, a back panel that is adapted to receive different Input/Output (I/O) covers that accommodate the different placement of I/O plugs on different baseboards, a vertical bulkhead having a plurality of different mounting locations for a CPU fan and an I/O fan, and a relocatable PCB support rod assembly adapted to support memory and I/O cards which are coupled to different locations on the various baseboards.

Abstract: A power supply includes a power cable interface. The power supply also includes an interface guard. The interface guard has an unlocked position and a locked position. When the interface guard is in the unlocked position, the power supply can be attached and detached from a chassis of an electrical system. When the interface guard is in the locked position, the power supply cannot be attached or detached from the chassis of the electrical system. The power cord can only be attached to the power supply while the interface guard is in the locked position.

Abstract: A floating connector housing has an attachment area for attaching a first connector. The floating connector housing also has two or more flanges for connecting the floating connector housing to a fixed surface. The two or more flanges allow the floating connector to have limited movement within the plane of the fixed surface. The floating connector housing also has one or more alignment pins for aligning the floating connector housing to allow the first connector to couple to a second connector. The floating connector housing can be used to turn a non-floating connector into a floating connector.