Patents by Inventor Brian S. Lombardo

Brian S. Lombardo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6656030
    Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: December 2, 2003
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Brian S. Lombardo
  • Publication number: 20020090819
    Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes an endless belt. The belt has an aperture. The aperture is unobstructed, such as using no window.
    Type: Application
    Filed: August 31, 1999
    Publication date: July 11, 2002
    Inventors: CANGSHAN XU, BRIAN S. LOMBARDO, RAJEEV BAJAJ, RAHUL K. SURANA
  • Patent number: 6406363
    Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: June 18, 2002
    Assignees: Lam Research Corporation, Peripheral Products, Inc.
    Inventors: Cangshan Xu, Brian S. Lombardo
  • Publication number: 20020068513
    Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
    Type: Application
    Filed: November 9, 2001
    Publication date: June 6, 2002
    Applicant: Lam Research Corporation
    Inventors: Cangshan Xu, Brian S. Lombardo