Abstract: A head gimbal assembly includes a slider, a flexure, and a plurality of solder receptacles. The slider has an air-bearing surface and a metallized backside opposite the air bearing surface. The flexure includes a flexure tongue layer at least partially formed of stainless steel. The flexure further includes at least one additional layer over the flexure tongue layer. The plurality of solder receptacles extend through the at least one additional layer to the flexure tongue layer. Solder fills at least one of the solder receptacles and contacts the stainless steel of the flexure tongue layer.

Abstract: A method and apparatus for utilizing an optimized polishing pad to increase planarity and reduce defects in CMP processing. The optimized polishing pad includes a polishing surface to remove material from and maintain a uniform polish rate with respect to a wafer surface. The polishing pad has a hardness between 62 and 98 shore A and a tensile modulus between 3,500 and 35,000 psi. A three-stage CMP process utilizes a hard pad, a first optimized pad and a second optimized pad to increase planarity while reducing surface defects.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A method for producing an aerosol generator utilizes a vibratable member having a plurality of apertures for producing liquid droplets upon vibration of the vibratable member. A support member is injection molded about the vibratable member, and a vibratable element is placed in vibrational communication with the vibratable member.

Abstract: A method for producing an aerosol generator utilizes a vibratable member having a plurality of apertures for producing liquid droplets upon vibration of the vibratable member. A support member is injection molded about the vibratable member, and a vibratable element is placed in vibrational communication with the vibratable member.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.