Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.

Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.

Abstract: Methods and systems for sensing a force using a sense die are provided. The sense die may include a slab die; an actuation element configured to contact the slab die and apply a force to the slab die; and one or more sense elements supported by the slab die.

Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.

Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.

Abstract: Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor and a ring mounted on the PCB. The pressure sensor assembly may include a force transmitting member positioned at least partially within the ring. The force transmitting member may transfer a force applied to a front side of the force transmitting member to a front side of the pressure sensor. A reservoir includes an extension that define an opening. The first side of the force transmitting member is exposed to the interior of the reservoir. The extension engages the first side of the force transmitting member to seal the opening.

Abstract: Embodiments relate generally to a system comprising a flow sensor assembly. The flow sensor assembly includes a housing defining a flow channel. The flow channel has an inlet serpentine portion fluidly coupled to an inlet port, and an outlet serpentine portion fluidly coupled to an outlet port. The housing further defines a sensor chamber fluidly coupling the inlet serpentine portion to the outlet serpentine portion, where the sensor chamber has a split planar region. The flow sensor assembly further includes a sensor die located proximate to the split planar region and configured to sense a measure related to a flow rate of a fluid.

Abstract: A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor and a ring mounted on the PCB. The pressure sensor assembly may include a force transmitting member positioned at least partially within the ring. The force transmitting member may transfer a force applied to a front side of the force transmitting member to a front side of the pressure sensor. For example, the force transmitting member may be exposed to a fluid within a reservoir or other sensed media and may transmit forces of the fluid and/or other sensed media to the pressure sensor. The force transmitting member may include a biocompatible material to facilitate use of the pressure sensor assembly in medical and/or food related applications. One example biocompatible material usable in the force transmitting member may be cured silicone elastomer.

Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.

Abstract: A flow sensor assembly. The flow sensor assembly comprises a housing defining a flow channel and a sensor die. The flow channel comprises an inlet and an outlet port, an inlet serpentine portion of the flow channel fluidly coupling to the inlet port, an outlet serpentine portion of the flow channel fluidly coupling to the outlet port, and a sensor chamber fluidly coupling the inlet serpentine portion to the outlet serpentine portion, where the sensor chamber defines a planar region, an inlet ramp that transitions between a bottom of an inlet of the sensor chamber to a spit portion of the planar region, an outlet ramp that transitions between a bottom of an outlet of the sensor chamber to the spit portion of the planar region. The sensor die is located proximate to the spit and configured to sense a measure related to a flow rate of a fluid.

Abstract: A switch assembly includes an M-blade snap spring, an actuation arm, and a switch. The M-blade snap spring exhibits snap-action movement between a first actuator position and a second actuator position. The switch is responsive to the snap-action movement of the M-blade to move between a first switch position and a second switch position. The actuation arm is configured to selectively cause the M-blade snap spring to move, via snap-action, between the first actuator position and the second actuator position, which in turn causes the switch to move between the first switch position and the second switch position, respectively.

Abstract: A switch assembly includes an M-blade snap spring, an actuation arm, and a switch. The M-blade snap spring exhibits snap-action movement between a first actuator position and a second actuator position. The switch is responsive to the snap-action movement of the M-blade to move between a first switch position and a second switch position. The actuation arm is configured to selectively cause the M-blade snap spring to move, via snap-action, between the first actuator position and the second actuator position, which in turn causes the switch to move between the first switch position and the second switch position, respectively.

Abstract: A flow sensor includes a main flow body, a laminar flow element, and first and second bypass channels. The first bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a first bypass flow passage between the laminar flow element and the main flow body. The second bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a second bypass flow passage between the laminar flow element and the main flow body.

Abstract: A flow sensor includes a main flow body, a laminar flow element, and first and second bypass channels. The first bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a first bypass flow passage between the laminar flow element and the main flow body. The second bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a second bypass flow passage between the laminar flow element and the main flow body.

Abstract: A snap-action switch includes an M-blade snap spring, an actuation arm, a first bridge, and a second bridge. The M-blade snap spring includes a closed end, a double-loop end, a first outer leg, a second outer leg, a first inner leg, a second inner leg, and a cross member. The actuation arm is coupled to the first and second inner legs, and distorts the M-blade snap to exhibit snap-action movement between a first switch position and a second switch position. When the M-blade snap spring is in the first switch position, the double-loop end engages the first bridge and does not engage the second bridge, and when the M-blade snap spring is in the second switch position, the double-loop end engages the second bridge and does not engage the first bridge.

Abstract: A sensor having a sensor bridge supported above a substrate is disclosed. A number of thermally isolating apertures are provided in the sensor bridge to help increase the thermal isolation of the sensor bridge from the substrate. In one illustrative embodiment, a heater element, an upstream sensor element, and/or a downstream sensor element are provided on the sensor bridge. A plurality of apertures may extend through the sensor bridge to thermally isolate the heater element, the upstream and/or downstream sensor element from the substrate and/or from each other. In one illustrative embodiment, the plurality of apertures may be provided at spaced locations adjacent a first lateral side of the sensor bridge, adjacent the second lateral side of the sensor bridge, between the heater element and the upstream sensor element, and/or between the heater element and the downstream sensor element. In some cases, the plurality of apertures may be substantially round, oval, rectangular and/or any other suitable shape.

Abstract: A sensor having a sensor bridge supported above a substrate is disclosed. A number of thermally isolating apertures are provided in the sensor bridge to help increase the thermal isolation of the sensor bridge from the substrate. In one illustrative embodiment, a heater element, an upstream sensor element, and/or a downstream sensor element are provided on the sensor bridge. A plurality of apertures may extend through the sensor bridge to thermally isolate the heater element, the upstream and/or downstream sensor element from the substrate and/or from each other. In one illustrative embodiment, the plurality of apertures may be provided at spaced locations adjacent a first lateral side of the sensor bridge, adjacent the second lateral side of the sensor bridge, between the heater element and the upstream sensor element, and/or between the heater element and the downstream sensor element. In some cases, the plurality of apertures may be substantially round, oval, rectangular and/or any other suitable shape.

Abstract: Method for fabricating a conductive elastomeric seal, which includes a set of springs plated with an electrically conductive material. Initially, the set of springs can be held in a z-axis position in a mold cavity shaped like a seal. A liquid elastomer can be injected into the mold cavity in such a manner that the elastomer can be over molded around and through coils of each spring. Finally, the elastomer seal with the springs can be removed from the mold cavity, when the elastomer is cured. Ends of each spring can be kept free from the elastomer during over-molding such that the elastomeric seal can provide an electrical contact with a pressure sensor die and electrical leads molded into a sensor housing. Such a conductive elastomeric seal can prevent a die-edge shorting with the sense die in order to achieve long-term sensor reliability and performance.

Abstract: A method and apparatus for improving the fatigue life of a wobblefram utilized in a micro switch. The flexible circular wobblefram can be formed with a fixed edge and a solid center region utilizing a punch and die at elevated temperatures. An external lever can be attached to the solid center region of the wobblefram. The lever can be loaded and actuated to transmit motion from outside of the micro switch to a sealed internal mechanism in order to perform a switching function. Circular and/or sinusoidal shaped corrugations can then be added to the wobblefram and evaluated for performance utilizing a finite element analysis (FEA) model. The FEA model can precisely evaluate and optimize profile, number and height of the circular and/or sinusoidal corrugations. Such a wobblefram with circular and/or sinusoidal corrugations can achieve higher lifetime without affecting the operating characteristics of the micro switch.

Abstract: Method for fabricating a conductive elastomeric seal, which includes a set of springs plated with an electrically conductive material. Initially, the set of springs can be held in a z-axis position in a mold cavity shaped like a seal. A liquid elastomer can be injected into the mold cavity in such a manner that the elastomer can be over molded around and through coils of each spring. Finally, the elastomer seal with the springs can be removed from the mold cavity, when the elastomer is cured. Ends of each spring can be kept free from the elastomer during over-molding such that the elastomeric seal can provide an electrical contact with a pressure sensor die and electrical leads molded into a sensor housing. Such a conductive elastomeric seal can prevent a die-edge shorting with the sense die in order to achieve long-term sensor reliability and performance.