Patents by Inventor Brian Speldrich

Brian Speldrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12474224
    Abstract: A method for sensing force using a sense die is disclosed. The method may include providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab. In some examples, the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.
    Type: Grant
    Filed: January 5, 2023
    Date of Patent: November 18, 2025
    Assignee: Honeywell International Inc.
    Inventors: Brian Speldrich, Richard Alan Davis
  • Patent number: 12386370
    Abstract: Various devices, assemblies, components, systems, and methods are provided relating to a volume flow rate smoothing device. An example smoothing device may include a body portion defining a chamber therein. The smoothing device may further include a first flow restrictor portion and a second flow restrictor portion each disposed in fluid communication with the body. The smoothing device may be configured to fluidically communicate with a pump via a first end of the smoothing device to receive a fluid flow from the pump along a fluid pathway extending through the first flow restrictor portion, the body portion, and the second flow restrictor portion. The first flow restrictor portion may be disposed upstream of the body portion. The second flow restrictor portion may be disposed downstream of the body portion.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: August 12, 2025
    Assignee: Honeywell International Inc.
    Inventors: Brian Speldrich, Jamie Speldrich, Ian Bentley
  • Publication number: 20240377846
    Abstract: Various devices, assemblies, components, systems, and methods are provided relating to a volume flow rate smoothing device. An example smoothing device may include a body portion defining a chamber therein. The smoothing device may further include a first flow restrictor portion and a second flow restrictor portion each disposed in fluid communication with the body. The smoothing device may be configured to fluidically communicate with a pump via a first end of the smoothing device to receive a fluid flow from the pump along a fluid pathway extending through the first flow restrictor portion, the body portion, and the second flow restrictor portion. The first flow restrictor portion may be disposed upstream of the body portion. The second flow restrictor portion may be disposed downstream of the body portion.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 14, 2024
    Inventors: Brian SPELDRICH, Jamie SPELDRICH, Ian BENTLEY
  • Patent number: 11959787
    Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Honeywell International Inc.
    Inventors: Brian Speldrich, Jamie Speldrich, Paul Bey, Scott Beck, Ian Bentley, Steven Lowery, Richard Bishop
  • Publication number: 20230146578
    Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 11, 2023
    Inventors: Brian SPELDRICH, Richard Alan DAVIS
  • Patent number: 11573136
    Abstract: Methods and systems for sensing a force using a sense die are provided. The sense die may include a slab die; an actuation element configured to contact the slab die and apply a force to the slab die; and one or more sense elements supported by the slab die.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: February 7, 2023
    Assignee: Honeywell International Inc.
    Inventors: Brian Speldrich, Richard Alan Davis
  • Publication number: 20220283007
    Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 8, 2022
    Inventors: Brian Speldrich, Jamie Speldrich, Paul Bey, Scott Beck, Ian Bentley, Steven Lowery, Richard Bishop
  • Publication number: 20200033207
    Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 30, 2020
    Inventors: Brian Speldrich, Richard Davis
  • Patent number: 10481024
    Abstract: Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor and a ring mounted on the PCB. The pressure sensor assembly may include a force transmitting member positioned at least partially within the ring. The force transmitting member may transfer a force applied to a front side of the force transmitting member to a front side of the pressure sensor. A reservoir includes an extension that define an opening. The first side of the force transmitting member is exposed to the interior of the reservoir. The extension engages the first side of the force transmitting member to seal the opening.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: November 19, 2019
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Richard Wade, Brian Speldrich, Richard C. Sorenson
  • Patent number: 10429222
    Abstract: Embodiments relate generally to a system comprising a flow sensor assembly. The flow sensor assembly includes a housing defining a flow channel. The flow channel has an inlet serpentine portion fluidly coupled to an inlet port, and an outlet serpentine portion fluidly coupled to an outlet port. The housing further defines a sensor chamber fluidly coupling the inlet serpentine portion to the outlet serpentine portion, where the sensor chamber has a split planar region. The flow sensor assembly further includes a sensor die located proximate to the split planar region and configured to sense a measure related to a flow rate of a fluid.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: October 1, 2019
    Assignee: Honeywell International Inc.
    Inventors: Jamie Speldrich, Brian Speldrich
  • Publication number: 20180306660
    Abstract: A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor and a ring mounted on the PCB. The pressure sensor assembly may include a force transmitting member positioned at least partially within the ring. The force transmitting member may transfer a force applied to a front side of the force transmitting member to a front side of the pressure sensor. For example, the force transmitting member may be exposed to a fluid within a reservoir or other sensed media and may transmit forces of the fluid and/or other sensed media to the pressure sensor. The force transmitting member may include a biocompatible material to facilitate use of the pressure sensor assembly in medical and/or food related applications. One example biocompatible material usable in the force transmitting member may be cured silicone elastomer.
    Type: Application
    Filed: April 20, 2017
    Publication date: October 25, 2018
    Inventors: Richard Wade, Brian Speldrich, Richard C. Sorenson
  • Publication number: 20180180494
    Abstract: Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 28, 2018
    Inventors: Brian Speldrich, Richard Alan Davis
  • Publication number: 20180172493
    Abstract: A flow sensor assembly. The flow sensor assembly comprises a housing defining a flow channel and a sensor die. The flow channel comprises an inlet and an outlet port, an inlet serpentine portion of the flow channel fluidly coupling to the inlet port, an outlet serpentine portion of the flow channel fluidly coupling to the outlet port, and a sensor chamber fluidly coupling the inlet serpentine portion to the outlet serpentine portion, where the sensor chamber defines a planar region, an inlet ramp that transitions between a bottom of an inlet of the sensor chamber to a spit portion of the planar region, an outlet ramp that transitions between a bottom of an outlet of the sensor chamber to the spit portion of the planar region. The sensor die is located proximate to the spit and configured to sense a measure related to a flow rate of a fluid.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 21, 2018
    Inventors: Jamie Speldrich, Brian Speldrich
  • Patent number: 9355795
    Abstract: A switch assembly includes an M-blade snap spring, an actuation arm, and a switch. The M-blade snap spring exhibits snap-action movement between a first actuator position and a second actuator position. The switch is responsive to the snap-action movement of the M-blade to move between a first switch position and a second switch position. The actuation arm is configured to selectively cause the M-blade snap spring to move, via snap-action, between the first actuator position and the second actuator position, which in turn causes the switch to move between the first switch position and the second switch position, respectively.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: May 31, 2016
    Assignee: Honeywell International Inc.
    Inventors: Mark Green, Steven Speece, Brian Speldrich
  • Publication number: 20150068879
    Abstract: A switch assembly includes an M-blade snap spring, an actuation arm, and a switch. The M-blade snap spring exhibits snap-action movement between a first actuator position and a second actuator position. The switch is responsive to the snap-action movement of the M-blade to move between a first switch position and a second switch position. The actuation arm is configured to selectively cause the M-blade snap spring to move, via snap-action, between the first actuator position and the second actuator position, which in turn causes the switch to move between the first switch position and the second switch position, respectively.
    Type: Application
    Filed: September 10, 2013
    Publication date: March 12, 2015
    Applicant: Honeywell International Inc.
    Inventors: Mark Green, Steven Speece, Brian Speldrich
  • Patent number: 8899108
    Abstract: A flow sensor includes a main flow body, a laminar flow element, and first and second bypass channels. The first bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a first bypass flow passage between the laminar flow element and the main flow body. The second bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a second bypass flow passage between the laminar flow element and the main flow body.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: December 2, 2014
    Assignee: Honeywell International Inc.
    Inventors: Jamie Speldrich, Richard Charles Sorenson, Andrew Joseph Milley, Brian Speldrich
  • Publication number: 20130098484
    Abstract: A flow sensor includes a main flow body, a laminar flow element, and first and second bypass channels. The first bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a first bypass flow passage between the laminar flow element and the main flow body. The second bypass channel is formed in, and extends at least partially around, the outer surface of the laminar flow element, and is in fluid communication with the main flow channel and defines a second bypass flow passage between the laminar flow element and the main flow body.
    Type: Application
    Filed: August 28, 2012
    Publication date: April 25, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Jamie Speldrich, Richard Charles Sorenson, Andrew Joseph Milley, Brian Speldrich
  • Publication number: 20130048483
    Abstract: A snap-action switch includes an M-blade snap spring, an actuation arm, a first bridge, and a second bridge. The M-blade snap spring includes a closed end, a double-loop end, a first outer leg, a second outer leg, a first inner leg, a second inner leg, and a cross member. The actuation arm is coupled to the first and second inner legs, and distorts the M-blade snap to exhibit snap-action movement between a first switch position and a second switch position. When the M-blade snap spring is in the first switch position, the double-loop end engages the first bridge and does not engage the second bridge, and when the M-blade snap spring is in the second switch position, the double-loop end engages the second bridge and does not engage the first bridge.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Brian Speldrich, Steven Speece, Mark Green
  • Patent number: 8286478
    Abstract: A sensor having a sensor bridge supported above a substrate is disclosed. A number of thermally isolating apertures are provided in the sensor bridge to help increase the thermal isolation of the sensor bridge from the substrate. In one illustrative embodiment, a heater element, an upstream sensor element, and/or a downstream sensor element are provided on the sensor bridge. A plurality of apertures may extend through the sensor bridge to thermally isolate the heater element, the upstream and/or downstream sensor element from the substrate and/or from each other. In one illustrative embodiment, the plurality of apertures may be provided at spaced locations adjacent a first lateral side of the sensor bridge, adjacent the second lateral side of the sensor bridge, between the heater element and the upstream sensor element, and/or between the heater element and the downstream sensor element. In some cases, the plurality of apertures may be substantially round, oval, rectangular and/or any other suitable shape.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: October 16, 2012
    Assignee: Honeywell International Inc.
    Inventor: Brian Speldrich
  • Publication number: 20120152014
    Abstract: A sensor having a sensor bridge supported above a substrate is disclosed. A number of thermally isolating apertures are provided in the sensor bridge to help increase the thermal isolation of the sensor bridge from the substrate. In one illustrative embodiment, a heater element, an upstream sensor element, and/or a downstream sensor element are provided on the sensor bridge. A plurality of apertures may extend through the sensor bridge to thermally isolate the heater element, the upstream and/or downstream sensor element from the substrate and/or from each other. In one illustrative embodiment, the plurality of apertures may be provided at spaced locations adjacent a first lateral side of the sensor bridge, adjacent the second lateral side of the sensor bridge, between the heater element and the upstream sensor element, and/or between the heater element and the downstream sensor element. In some cases, the plurality of apertures may be substantially round, oval, rectangular and/or any other suitable shape.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 21, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventor: Brian Speldrich