Patents by Inventor Brian Squires

Brian Squires has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250035556
    Abstract: Chemical composition of a component fabricated using high energy density input based three-dimensional additive manufacturing is in-situ monitored in real time. Laser Energy Assisted Breakdown Spectroscopy (LEABS) is coupled with a rapid physics-informed peak identification algorithm (RPIPIA) to monitor the atomic composition of component material (metallic, intermetallic, ceramic and metallic or ceramic matrix composites) in pseudo-real time during its fabrication using high energy density (laser, ion beam, gas plasma, electric resistance/discharge, gas torch) input (HEDI) based additive manufacturing.
    Type: Application
    Filed: July 16, 2024
    Publication date: January 30, 2025
    Applicant: University of North Texas
    Inventors: Narendra B. Dahotre, Andrey Voevodin, Brian Squires
  • Publication number: 20040186799
    Abstract: This invention concerns a method for processing cheque and deposit vouchers by a financial institution (Proof of Deposit). The method involves an operator preparing vouchers for feeding into a machine reader. Capturing an image from the voucher. Correcting incorrectly read scan lines. Automatically notifying the operator when a transaction boundary is detected and suspending processing of vouchers until the transaction is manually balanced. Finalising processing of each voucher by printing captured and trace details on each voucher.
    Type: Application
    Filed: February 5, 2004
    Publication date: September 23, 2004
    Inventors: Charles Dunn, Brian Squires