Patents by Inventor Brian T. Cantrell

Brian T. Cantrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190381575
    Abstract: The present invention provides a grooving tool for machining the surface of a polymeric foam article, such as a chemical mechanical (CMP) polishing pad, the grooving tool comprising a flat bed platen on which the article sits, a grooving tool frame having a front face positioned parallel to and facing the flat surface of the polymeric foam article on which front face is contained one or more cutting tool teeth arranged in a predetermined direction and with a constant pitch. Each cutting tool tooth has a non-cutting shoulder where it joins the grooving tool frame (i) a groove cutting face that forms a rake angle ranging from 2° to 80°, (ii) a chip ejection face located on the top of the tooth between the non-cutting shoulder and the groove cutting face and (iv) a shouldering radius transitioning from the cutting tool tooth to the non-cutting shoulder.
    Type: Application
    Filed: August 27, 2019
    Publication date: December 19, 2019
    Inventors: Patrick S. Delaney, Jeffrey Robert Stack, Brian T. Cantrell
  • Publication number: 20180281076
    Abstract: The present invention provides a grooving tool for machining the surface of a polymeric foam article, such as a chemical mechanical (CMP) polishing pad, the grooving tool comprising a flat bed platen on which the article sits, a grooving tool frame having a front face positioned parallel to and facing the flat surface of the polymeric foam article on which front face is contained one or more cutting tool teeth arranged in a predetermined direction and with a constant pitch. Each cutting tool tooth has a non-cutting shoulder where it joins the grooving tool frame (i) a groove cutting face that forms a rake angle ranging from 2° to 80°, (ii) a chip ejection face located on the top of the tooth between the non-cutting shoulder and the groove cutting face and (iv) a shouldering radius transitioning from the cutting tool tooth to the non-cutting shoulder.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: Patrick S. Delaney, Jeffrey Robert Stack, Brian T. Cantrell
  • Patent number: 10086543
    Abstract: The present invention provides an apparatus for use in mixing and dispensing a curable fluid stream (stream) into an open mold to fill the mold to make polishing pads for chemical mechanical planarization of substrates. The apparatus comprises an actuator frame on which is mounted (i) a set of two plates releasably attached to the actuator frame and adapted to cut the stream when the mold is full and to release from the actuator frame after cutting the stream, and (ii) a dispenser unit for continuous pouring of the stream into an open mold, the apparatus adapted to enable removal of the released plates from the actuator during the continuous pouring after the mold is full, e.g. by raising the actuator frame and the (ii) dispenser unit, whereby one can place a container above the mold to catch the plates.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: October 2, 2018
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Brian T. Cantrell
  • Publication number: 20180043588
    Abstract: The present invention provides an apparatus for use in mixing and dispensing a curable fluid stream (stream) into an open mold to fill the mold to make polishing pads for chemical mechanical planarization of substrates. The apparatus comprises an actuator frame on which is mounted (i) a set of two plates releasably attached to the actuator frame and adapted to cut the stream when the mold is full and to release from the actuator frame after cutting the stream, and (ii) a dispenser unit for continuous pouring of the stream into an open mold, the apparatus adapted to enable removal of the released plates from the actuator during the continuous pouring after the mold is full, e.g. by raising the actuator frame and the (ii) dispenser unit, whereby one can place a container above the mold to catch the plates.
    Type: Application
    Filed: August 9, 2016
    Publication date: February 15, 2018
    Inventor: Brian T. Cantrell
  • Patent number: 9034063
    Abstract: A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: May 19, 2015
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jeffrey James Hendron, Kenneth Vavala, Jeffrey Borcherdt Miller, Brian T. Cantrell, James T. Murnane, Kathleen McHugh, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young
  • Patent number: 8986585
    Abstract: A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 24, 2015
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Patent number: 8709114
    Abstract: A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: April 29, 2014
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Publication number: 20140083018
    Abstract: A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 27, 2014
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jeffrey James Hendron, Kenneth Vavala, Jeffrey Borcherdt Miller, Brian T. Cantrell, James T. Murnane, Kathleen McHugh, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young
  • Publication number: 20130247476
    Abstract: A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
  • Publication number: 20130247477
    Abstract: A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 26, 2013
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Brian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller