Patents by Inventor Brian T. Deram

Brian T. Deram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of controlling solder deposition utilizing two fluxes and preform
    Patent number: 6786391
    Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: September 7, 2004
    Assignee: KAC Holdings, Inc.
    Inventors: John N. Stipp, Brian T. Deram
  • Method of controlling solder deposition utilizing two fluxes and preform
    Publication number: 20040074952
    Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.
    Type: Application
    Filed: October 16, 2002
    Publication date: April 22, 2004
    Inventors: John N. Stipp, Brian T. Deram