Patents by Inventor Brian Thibault

Brian Thibault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
    Publication number: 20060105547
    Abstract: A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips.
    Type: Application
    Filed: November 16, 2004
    Publication date: May 18, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Audette, Steven Codding, Timothy Krywanczyk, Brian Thibault, Matthew Whalen