Abstract: Subject matter disclosed herein may relate a communication interface to read from and/or to write to one or more entries of a bio-ledger and/or a biosphere ledger of a particular individual stored at a secure storage device and at least one processor to generate signals and/or states representative of behavioral profile content for a particular user based, at least in part, on signals and/or states obtained from one or more sensors, wherein the at least one processor to identify or predict, or a combination thereof, a change in omic state for the particular individual based at least in part on the one or more bio-ledger entries, the behavioral profile content, or the one or more biosphere ledger entries, or a combination thereof.

Abstract: According to one implementation of the present disclosure, a circuit structure is configured to store charge in a charge-based storage element, where the charge-based storage element is disposed at least partially in a shallow-trench-isolation (STI) region of the circuit. According to one implementation of the present disclosure, a method includes: providing a circuit structure disposed on a substrate and a shallow-trench-isolation (STI) region of a circuit; forming an opening of the substrate and the STI region by removing a portion of the substrate and STI region; placing a first liner material in the opening and on remaining portions of the substrate and the STI region; and depositing a first metal layer in the opening on the first liner material.

Abstract: Various implementations described herein are related to a device having multiple transistors that are arranged as a bitcell. The multiple transistors may include multiple P-type transistors that are arranged in a P-over-P stack configuration, and the multiple transistors may include multiple N-type transistors that are arranged in an N-over-N stack configuration.

Abstract: Various implementations described herein refer to a device having a memory structure with a substrate. The device may have a signal wire buried or partially buried within at least one of the substrate and a dielectric for transmitting electrical signals. The device may be manufactured as a memory device having a memory cell structure with the signal wire buried or partially buried in the substrate.

Abstract: Various implementations described herein are related to a device having a multi-device stack structure for use in multi-layered circuit architectures. The multi-device stack structure may have P-type transistors and N-type transistors that are arranged vertically in a multi-transistor stack configuration. In some implementations, the device may have a multi-device stack structure for use in multi-bit memory and/or logic architecture that is formed with complementary field effect transistor (CFET) technology.

Abstract: According to one implementation of the present disclosure, a method includes fabricating a memory macro unit; forming a through silicon via (TSV); and bonding the TSV at least partially through the fabricated memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: A method and apparatus for generating a design for a 3D integrated circuit (3DIC) comprises extracting at least one design characteristic from a first data representation of a design for a 2D integrated circuit (2DIC) generated according to the design criteria required for the 3DIC. Components of the 3DIC are partitioned into groups (each representing one tier of the 3DIC) based on the extracted design characteristic. A second data representation of a 2DIC design is generated comprising multiple adjacent partitions each comprising the component groups for one tier of the 3DIC design together with inter-tier via ports representing locations of inter-tier vias. A placement for each partition is determined separately from a placement of corresponding components of the 2DIC represented by the original first data representation. This approach allows a 2DIC EDA tool to be used for designing a 3DIC.

Abstract: According to one implementation of the present disclosure, a method includes providing one or more tuning parameters of a transistor device at a first temperature of a range of temperatures below a temperature threshold; and adjusting the one or more tuning parameters until one or more second parameters of the transistor device corresponds to substantially the same value at the first temperature as a second temperature above the temperature threshold.

Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: Various implementations described herein are related to a device having multiple transistors that are arranged as a bitcell. The multiple transistors may include multiple P-type transistors that are arranged in a P-over-P stack configuration, and the multiple transistors may include multiple N-type transistors that are arranged in an N-over-N stack configuration.

Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

Abstract: Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.

Abstract: Disclosed are devices and techniques for facilitating transmission of light signals between optical waveguides formed on integrated circuit (IC) devices. In an implementation, one or more first waveguides may be formed in a structure such that at least a portion of the one or more first waveguides are exposed for optical connectivity. The structure may comprise first features to enable the structure to be interlocked with an IC device comprising second features complementary with the first features, so as to align at least a portion of the one or more first waveguides exposed to optically couple with one or more second waveguides formed in the first integrated circuit device.

Abstract: Implementations described herein are directed to a device with a processor and memory having stored thereon instructions that, when executed by the processor, cause the processor to acquire an integrated circuit layout of physical cells from a database and define wirelength relationships between input/output connections and a cell count for the physical cells in multiple domains. The instructions may cause the processor to define wirelength parameters of the integrated circuit layout in each domain of the multiple domains and generate a data file for the integrated circuit layout of the physical cells based on the wirelength relationships and the wirelength parameters to guide power and performance of the integrated circuit layout of the physical cells. The instructions may cause the processor to fabricate, or contribute to the fabrication of, an integrated circuit based on the data file for the integrated circuit layout of the physical cells.

Abstract: Various implementations described herein are directed to a method that defines tiers of an integrated circuit having standard cells placed adjacent to each other in a multi-tier placement. The integrated circuit includes multi-tier nets connected with inter-tier connections. The method includes pairing inter-tier connections as inter-tier-connection pairs belonging to a same net. The method includes grouping standard cells in groups with or without inter-tier-connection pairs from the tiers. The method includes relating the standard cells with or without inter-tier-connection pairs within each group from the groups by generating a multi-tier fence boundary around physical locations of the standard cells with or without inter-tier-connection pairs.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate copying of memory states between the volatile and non-volatile memory bitcells.

Abstract: Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.

Abstract: Broadly speaking, embodiments of the present technique provide a neuron for a spiking neural network, where the neuron is formed of at least one Correlated Electron Random Access Memory (CeRAM) element or Correlated Electron Switch (CES) element.

Abstract: Subject matter disclosed herein may relate to at least one processor to selectively authorize requests from one or more external devices to read from and/or write to particular bio-ledger entries and/or particular biosphere ledger entries based, at least in part, on security tokens provided by the one or more external devices and based, at least in part, on first and/or second sets of particular authorizations.

Abstract: Subject matter disclosed herein may relate to at least one processor to establish a communication connection between a portable computing device and a particular external device, the at least one processor to initiate transmission of one or more signal packets representative of one or more communication, security, and/or cryptographic parameters to the particular external device responsive at least in part to the establishing the communication connection.