Patents by Inventor Brian Veraa

Brian Veraa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230252218
    Abstract: Aspects of the invention include systems and methods configured to provide hierarchical circuit designs that makes use of effective metal density screens during hierarchical design rule checking (DRC) analysis. A non-limiting example computer-implemented method includes providing a first hierarchical level of a chip design. The first hierarchical level includes one or more internal shapes and at least one blockage shape having an internal structure defined at a second hierarchical level of the chip design. A tuple is assigned to the blockage shape. The tuple includes a metal layer identifier for the blockage shape, a minimum expected density for the blockage shape, and a maximum expected density for the blockage shape. The method includes determining whether a density violation exists in the first hierarchical level based in part on one or both of the minimum expected density for the blockage shape and the maximum expected density for the blockage shape.
    Type: Application
    Filed: February 8, 2022
    Publication date: August 10, 2023
    Inventors: BRIAN VERAA, Ryan Michael Kruse, Christopher Gonzalez, David Wolpert
  • Patent number: 11586798
    Abstract: A system is configured to avoid establishing an electrostatic discharge (ESD) region in an integrated circuit (IC). The system includes a processor and memory storing an IC simulator. The IC simulator establishes an IC chip that is sub-divided into a plurality of hierarchical levels. The IC simulator further analyzes a first hierarchical level to determine first connectivity information indicating connectivity between the first hierarchical level and one or both of lower-level pins and lower-level nets of a targeted hierarchical level having a lower-level of hierarchy with respect to the first hierarchical level and analyzes the targeted hierarchical level to determine second connectivity information indicating diode connectivity to one or both high-level pins and higher-level nets included in the first hierarchical level.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: February 21, 2023
    Assignee: International Business Machines Corporation
    Inventors: Brian Veraa, David Wolpert, Ryan Michael Kruse, Christopher Gonzalez
  • Publication number: 20230048541
    Abstract: A system is configured to avoid establishing an electrostatic discharge (ESD) region in an integrated circuit (IC). The system includes a processor and memory storing an IC simulator. The IC simulator establishes an IC chip that is sub-divided into a plurality of hierarchical levels. The IC simulator further analyzes a first hierarchical level to determine first connectivity information indicating connectivity between the first hierarchical level and one or both of lower-level pins and lower-level nets of a targeted hierarchical level having a lower-level of hierarchy with respect to the first hierarchical level and analyzes the targeted hierarchical level to determine second connectivity information indicating diode connectivity to one or both high-level pins and higher-level nets included in the first hierarchical level.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Inventors: Brian Veraa, David Wolpert, Ryan Michael Kruse, Christopher Gonzalez