Patents by Inventor Brian VIA

Brian VIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230340267
    Abstract: Engineered wood products and binder compositions for cold-pressed applications are provided. Methods are also provided for formulating binders and producing the engineered wood products. The binder comprises a soy product and an adhesive formulation. The binders are prepared by mixing the soy product with the adhesive formulation prior to application to a lignocellulosic material to form the engineered wood. The present compositions and methods provide enhanced bonding and shorter holding time at decreased cost.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 26, 2023
    Applicant: AUBURN UNIVERSITY
    Inventors: BRIAN VIA, SUJIT BANERJEE, OSEI A. ASAFU-ADJAYE, ABIODUN O. ALAWODE
  • Publication number: 20230115487
    Abstract: Methods of dewatering viscous materials are provided. The method comprises contacting the viscous material with pressurized carbon dioxide at a temperature and for a time wherein at least a fraction of water is expressed from the viscous material. Then the pressure is released, and the water expressed from the viscous material is removed to yield a dewatered product. Exemplary viscous materials that can be dewatered by the method include black liquor from wood pulping operations, wet lignin, wet super water absorbent polymers and sugar solutions. The pressurized carbon dioxide is present in subcritical or supercritical form. The method provides dewatering at reduced cost.
    Type: Application
    Filed: September 28, 2022
    Publication date: April 13, 2023
    Applicant: Auburn University
    Inventors: Osei Asafu-Adjaye, Brian Via, Bhima Sastri, Sujit Banerjee
  • Patent number: 10899039
    Abstract: Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: January 26, 2021
    Assignee: Auburn University
    Inventors: Brian Via, Sujit Banerjee
  • Patent number: 10266694
    Abstract: Methods are provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations can be in either liquid or solid form and are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: April 23, 2019
    Assignee: Auburn University
    Inventors: Brian Via, William G. Hand, Sujit Banerjee
  • Publication number: 20170266930
    Abstract: Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
    Type: Application
    Filed: March 16, 2017
    Publication date: September 21, 2017
    Inventors: Brian Via, Sujit Banerjee
  • Publication number: 20160264781
    Abstract: Methods are provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations can be in either liquid or solid form and are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.
    Type: Application
    Filed: March 11, 2016
    Publication date: September 15, 2016
    Inventors: Brian VIA, William G. Hand, Sujit Banerjee