Patents by Inventor Brian Vicich

Brian Vicich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9841572
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: December 12, 2017
    Assignee: SAMTEC, INC.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 9651752
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: May 16, 2017
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20160291274
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20160269118
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: May 18, 2016
    Publication date: September 15, 2016
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Patent number: 9374165
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: June 21, 2016
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 8979551
    Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: March 17, 2015
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser, Brian Vicich
  • Patent number: 8894423
    Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 25, 2014
    Assignee: Samtec, Inc.
    Inventors: John Mongold, Randall Musser, Brian Vicich, Neal Patterson
  • Publication number: 20140286646
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 4, 2014
    Publication date: September 25, 2014
    Applicant: Samtec, Inc.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20140242817
    Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: SAMTEC, INC.
    Inventors: John MONGOLD, Randall MUSSER, Brian VICICH, Neal PATTERSON
  • Patent number: 8787711
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: July 22, 2014
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20140148022
    Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 29, 2014
    Applicant: Samtec, Inc.
    Inventors: John MONGOLD, Randall MUSSER, Brian VICICH
  • Patent number: 8588561
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 19, 2013
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Patent number: 8588562
    Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: November 19, 2013
    Assignee: Samtec, Inc.
    Inventors: Eric Zbinden, Randall Musser, Jean-Marc André Verdiell, John Mongold, Brian Vicich, Keith Guetig
  • Publication number: 20130236186
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: May 16, 2013
    Publication date: September 12, 2013
    Applicant: SAMTEC, INC.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20130004120
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: SAMTEC, INC.
    Inventors: Eric ZBINDEN, Randall MUSSER, Jean-Marc André VERDIELL, John MONGOLD, Brian VICICH, Keith GUETIG
  • Publication number: 20100186997
    Abstract: A method for attaching a fusible member to a flexible circuit board includes providing the flexible circuit board including an electrode and a hole near each other, placing the fusible member in the hole, and deforming the fusible member to fix the fusible member to the flexible circuit board. A flexible circuit board includes an electrode, a hole, and a fusible member fixed to the hole and arranged to establish an electrical connection with the electrode when the fusible member is fused to the electrode.
    Type: Application
    Filed: January 28, 2010
    Publication date: July 29, 2010
    Applicant: SAMTEC INC.
    Inventor: Brian VICICH
  • Publication number: 20100173507
    Abstract: An electrical connector includes a first row of contacts, a second row of contacts, a first ground plane, a second ground plane, each extending in a first direction. The first row of contacts is located closer to the first ground plane than any other ground plane in the electrical connector. The second row of contacts is located closer to the second ground plane than any other ground plane in the electrical connector. The first row of contacts, the second row of contacts, the first ground plane, and the second ground plane oppose each other such that the first row of contacts, the second row of contacts, the first ground plane, and the second ground plane are arranged with respect to each other in a second direction perpendicular or substantially perpendicular to the first direction.
    Type: Application
    Filed: January 7, 2009
    Publication date: July 8, 2010
    Applicant: Samtec, Inc.
    Inventors: Brian VICICH, John MONGOLD, Chad FAITH, James NADOLNY
  • Publication number: 20100144177
    Abstract: An electrical connector includes a first connector module having at least one electrical contact and having a male mechanical connector and a second connector module having at least one electrical contact and having a female mechanical connector. The male mechanical connector and the female mechanical connector are arranged to connect the first connector module and the second connector module to one another. The male mechanical connector includes an alignment rail and a locking projection. The female mechanical connector includes an alignment slot and a locking channel. The alignment rail and the alignment slot are engaged with each other. The locking projection and the locking channel are engaged with each other.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 10, 2010
    Applicant: Samtec, Inc.
    Inventors: Brian VICICH, Kevin MEREDITH
  • Publication number: 20090215309
    Abstract: An electrical connector includes a connector frame, a plurality of contacts disposed in the connector frame, a plurality of cables, each of which includes at least one center conductor. The at least one center conductor of each of the plurality of cables is directly connected to a respective one of the plurality of contacts.
    Type: Application
    Filed: February 22, 2008
    Publication date: August 27, 2009
    Applicant: SAMTEC, INC.
    Inventors: John Mongold, Brian Vicich
  • Patent number: 7377795
    Abstract: An electrical contact for use in an electrical connector, includes a contact body made of metal and having a contact head, a contact tail, and an anti-wicking region disposed between the contact head and the contact tail arranged to prevent wicking of a fusible material past the anti-wicking region in a direction toward the contact head. The anti-wicking region is defined by one of a laser-ablated portion, a laser marking material, a UV marking material, and an ink that is permanently disposed on the contact body.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: May 27, 2008
    Assignee: Samtec, Inc.
    Inventors: Brian Vicich, Steve Koopman