Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, a display device includes a light modulating array and a light guide configured to receive light into at least one edge of the light guide. The light guide can be characterized by a first refractive index. The display device can also include a light turning layer disposed such that the light guide is at least partially between the turning layer and the array. The turning layer can comprise an inorganic material characterized by a second refractive index that is substantially the same as the first refractive index.

Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, an illumination apparatus includes a light source, a light guide having a planar first surface, a first end and a second end, and a length therebetween, the light guide positioned to receive light from the light source into the light guide first end, and the light guide configured such that light from the light source provided into the first end of the light guide propagates towards the second end, and a plurality of light turning features that are configured to reflect light propagating towards the second end of the light guide out of the planar first surface of the light guide, each light turning feature having a turning surface and an interferometric stack formed on the turning surface.

Abstract: A static interferometric image device including a plurality of solidified liquid layers is formed over a substrate by an inkjet process such that the layers are lateral to one another. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the solidified liquid layers are formed on the surface. Optical fillers or spacers are provided for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Abstract: This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, a passivation layer is attached to the light guide of an illumination device. The passivation layer may be an optically transparent moisture barrier and may have a thickness and refractive index which allows it to function as an anti-reflective coating. The passivation layer may protect moisture-sensitive underlying features, such as metallized light turning features that may be present in the light guide. The light turning features may be configured to redirect light out of the light guide. In some implementations, the redirected light may be applied to illuminate a display.

Abstract: This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, the light guide includes a light turning film over an optically transmissive supporting layer. The light turning film may be formed of a material deposited in the liquid state. The light turning film may be formed of a photodefinable material, which may be glass, such a spin-on glass, or may be a polymer. In some other implementations, the glass is not photodefinable. The light turning film may have indentations that define light turning features and a protective layer may be formed over those indentations. The protective layer may also be formed of a glass material, such as spin-on glass. The light turning features in the light guide film may be configured to redirect light out of the light guide, for example, to illuminate a display.

Abstract: Methods of fabricating a static interferometric image device and static interferometric image device formed by the same are disclosed. In one embodiment, a method includes providing a substrate. A plurality of liquid layers are formed over the substrate by an inkjet process such that the layers are lateral to one another. The liquid layers contain a solidifiable material or particles. Then, the plurality of liquid layers are solidified to form a plurality of solid layers. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the liquid layers are formed on the surface. The inkjet process provides optical fillers or spacers for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Abstract: Methods of fabricating a static interferometric image device and static interferometric image device formed by the same are disclosed. In one embodiment, a method includes providing a substrate. A plurality of liquid layers are formed over the substrate by an inkjet process such that the layers are lateral to one another. The liquid layers contain a solidifiable material or particles. Then, the plurality of liquid layers are solidified to form a plurality of solid layers. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the liquid layers are formed on the surface. The inkjet process provides optical fillers or spacers for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, a display device includes a light modulating array and a light guide configured to receive light into at least one edge of the light guide. The display device can also include a light turning layer disposed such that the light guide is at least partially between the turning layer and the array. The turning layer can comprise at least one light turning feature having at least one curved turning surface.

Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, a display device includes a light modulating array and a light guide configured to receive light into at least one edge of the light guide. The light guide can be characterized by a first refractive index. The display device can also include a light turning layer disposed such that the light guide is at least partially between the turning layer and the array. The turning layer can comprise an inorganic material characterized by a second refractive index that is substantially the same as the first refractive index.

Abstract: Illumination devices and methods of making same are disclosed. In one embodiment, an illumination apparatus includes a light source, a light guide having a planar first surface, a first end and a second end, and a length therebetween, the light guide positioned to receive light from the light source into the light guide first end, and the light guide configured such that light from the light source provided into the first end of the light guide propagates towards the second end, and a plurality of light turning features that are configured to reflect light propagating towards the second end of the light guide out of the planar first surface of the light guide, each light turning feature having a turning surface and an interferometric stack formed on the turning surface.

Abstract: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: Methods of fabricating a static interferometric image device and static interferometric image device formed by the same are disclosed. In one embodiment, a method includes providing a substrate. A plurality of liquid layers are formed over the substrate by an inkjet process such that the layers are lateral to one another. The liquid layers contain a solidifiable material or particles. Then, the plurality of liquid layers are solidified to form a plurality of solid layers. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the liquid layers are formed on the surface. The inkjet process provides optical fillers or spacers for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Abstract: Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

Abstract: A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

Abstract: An integrated passive component device in which an anodized metal capacitor and a HTD capacitor are fabricated with a protective conductive metal layer disposed between the dielectric layer of the anodized metal capacitor and the dielectric layer of the HTD capacitor. The protective conductive metal layer helps to prevent process chemicals and conditions used to fabricate the dielectric layer of the HTD capacitor from adversely affecting the dielectric layer of the anodized metal capacitor. The anodized metal capacitor and the high temperature deposition capacitor are fabricated on the same substrate using only one masking operation.