Patents by Inventor Brian W. Steele

Brian W. Steele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8730913
    Abstract: A data interface for transferring digital data between a host and a client over a communication path using packet structures linked together to form a communication protocol for communicating a pre-selected set of digital control and presentation data. The signal protocol is used by link controllers configured to generate, transmit, and receive packets forming the communications protocol, and to form digital data into one or more types of data packets, with at least one residing in the host device and being coupled to the client through the communications path. The interface provides a cost-effective, low power, bi-directional, high-speed data transfer mechanism over a short-range “serial” type data link, which lends itself to implementation with miniature connectors and thin flexible cables which are especially useful in connecting display elements such as wearable micro-displays to portable computers and wireless communication devices.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: May 20, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Jon James Anderson, Brian W. Steele, George Alan Wiley, Shashank Shekhar
  • Patent number: 8635358
    Abstract: A data Interface for transferring digital data between a host and a client over a communication path using packet structures linked together to form a communication protocol for communicating a pre-selected set of digital control and presentation data. The signal protocol is used by link controllers configured to generate, transmit, and receive packets forming the communications protocol, and to form digital data into one or more types of data packets, with at least one residing in the host device and being coupled to the client through the communications path. The interface provides a cost-effective, low power, bi-directional, high-speed data transfer mechanism over a short-range “serial” type data link, which lends itself to implementation with miniature connectors and thin flexible cables which are especially useful in connecting display elements such as wearable micro-displays to portable computers and wireless communication devices.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: January 21, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Jon James Anderson, Brian W. Steele, George Alan Wiley, Shashank Shekhar
  • Patent number: 8625625
    Abstract: A data interface for transferring digital data between a host and a client over a communication path using packet structures linked together to form a communication protocol for communicating a pre-selected set of digital control and presentation data. The signal protocol is used by link controllers configured to generate, transmit, and receive packets forming the communications protocol, and to form digital data into one or more types of data packets, with at least one residing in the host device and being coupled to the client through the communications path. The interface provides a cost-effective, low power, bi-directional, high-speed data transfer mechanism over a short-range “serial” type data link, which lends itself to implementation with miniature connectors and thin flexible cables which are especially useful in connecting display elements such as wearable micro-displays to portable computers and wireless communication devices.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: January 7, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Jon James Anderson, Brian W. Steele, George Alan Wiley, Shashank Shekhar
  • Patent number: 8031626
    Abstract: An Enhanced Reverse Link Encapsulation packet for a MDDI system combines and improves upon the functionality of the Round Trip Delay Measurement packet and Reverse Encapsulation packet. The combination of these packets allows for reduced MDDI link overhead when providing client reverse link transmission. This packet allows for dynamic reverse link bandwidth allocation and therefore improved MDDI link utilization.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: October 4, 2011
    Assignee: QUALCOMM Incorporated
    Inventors: George Alan Wiley, Brian W. Steele, Shashank Shekhar, Laura A. Randall
  • Publication number: 20090187672
    Abstract: An Enhanced Reverse Link Encapsulation packet for a MDDI system combines and improves upon the functionality of the Round Trip Delay Measurement packet and Reverse Encapsulation packet. The combination of these packets allows for reduced MDDI link overhead when providing client reverse link transmission. This packet allows for dynamic reverse link bandwidth allocation and therefore improved MDDI link utilization.
    Type: Application
    Filed: November 12, 2008
    Publication date: July 23, 2009
    Applicant: QUALCOMM INCORPORATED
    Inventors: George Alan Wiley, Brian W. Steele, Shashank Shekhar, Laura A. Randall