Patents by Inventor Brian Wayne Herbst

Brian Wayne Herbst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040051178
    Abstract: A metal plus low dielectric constant (low-k) interconnect structure is provided for a semiconductor device wherein adjacent regions in a surface separated by a dielectric have dimensions in width and spacing in the sub 250 nanometer range, and in which reduced lateral leakage current between adjacent metal lines, and a lower effective dielectric constant than a conventional structure, is achieved by the positioning of a differentiating or mask member that is applied for the protection of the dielectric in subsequent processing operations, at a position about 2-5 nanometers below a, to be planarized, surface where there will be a lower electric field.
    Type: Application
    Filed: September 12, 2003
    Publication date: March 18, 2004
    Applicant: International Business Machines Corporation
    Inventors: Stephen Alan Cohen, Timothy Joseph Dalton, John Anthony Fitzsimmons, Stephen McConnell Gates, Brian Wayne Herbst, Sampath Purushothaman, Stanley Joseph Whitehair
  • Patent number: 6657305
    Abstract: A metal plus low dielectric constant (low-k) interconnect structure is provided for a semiconductor device wherein adjacent regions in a surface separated by a dielectric have dimensions in width and spacing in the sub 250 nanometer range, and in which reduced lateral leakage current between adjacent metal lines, and a lower effective dielectric constant than a conventional structure, is achieved by the positioning of a differentiating or mask member that is applied for the protection of the dielectric in subsequent processing operations, at a position about 2-5 nanometers below a, to be planarized, surface where there will be a lower electric field.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Stephen Alan Cohen, Timothy Joseph Dalton, John Anthony Fitzsimmons, Stephen McConnell Gates, Brian Wayne Herbst, Sampath Purushothaman, Stanley Joseph Whitehair
  • Patent number: 6207787
    Abstract: A co-polymer of benzophenone and bisphenol A has been shown to have DUV absorption properties. Therefore, the co-polymer has particular utility as an antireflective coating in microlithography applications. Incorporating anthracene into the co-polymer backbone enhances absorption at 248 nm. The endcapper used for the co-polymer can vary widely depending on the needs of the user and can be selected to promote adhesion, stability, and absorption of different wavelengths.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: March 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: James Thomas Fahey, Brian Wayne Herbst, Leo Lawrence Linehan, Wayne Martin Moreau, Gary Thomas Spinillo, Kevin Michael Welsh, Robert Lavin Wood
  • Patent number: 5736301
    Abstract: A co-polymer of benzophenone and bisphenol A has been shown to have DUV absorption properties. Therefore, the co-polymer has particular utility as an antireflective coating in microlithography applications. Incorporating anthracene into the co-polymer backbone enhances absorption at 248 nm. The endcapper used for the co-polymer can vary widely depending on the needs of the user and can be selected to promote adhesion, stability, and absorption of different wavelengths.
    Type: Grant
    Filed: October 1, 1996
    Date of Patent: April 7, 1998
    Assignee: International Business Machines Corporation
    Inventors: James Thomas Fahey, Brian Wayne Herbst, Leo Lawrence Linehan, Wayne Martin Moreau, Gary Thomas Spinillo, Kevin Michael Welsh, Robert Lavin Wood