Patents by Inventor Brian Wheelock

Brian Wheelock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
    Patent number: 7004375
    Abstract: The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: February 28, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Jayesh Shah, Brian Wheelock, Quinn K. Tong
  • Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
    Publication number: 20040232210
    Abstract: The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.
    Type: Application
    Filed: May 23, 2003
    Publication date: November 25, 2004
    Inventors: Jayesh Shah, Brian Wheelock, Quinn K. Tong
  • No-flow underfill encapsulant
    Patent number: 6624216
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 23, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Paul Morganelli, Anthony DeBarros, Brian Wheelock, Jayesh Shah
  • No-flow underfill encapsulant
    Publication number: 20030149135
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Application
    Filed: January 31, 2002
    Publication date: August 7, 2003
    Inventors: Paul Morganelli, Anthony Debarros, Brian Wheelock, Jayesh Shah