Patents by Inventor Brian William Arbuckle

Brian William Arbuckle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130135318
    Abstract: This disclosure provides systems, methods and apparatus for display assemblies. In one aspect, a display assembly may include a first panel, a second panel, and a third panel. The second panel may be spaced apart from the first panel, and the third panel may be spaced apart from the second panel. A first perimeter frame may join the first panel and the second panel, with the first perimeter frame defining a first cavity in between the first panel and the second panel. The first cavity may be substantially filled with a first liquid. A second perimeter frame may join the second panel and the third panel, with the second perimeter frame defining a second cavity in between the second panel and the third panel. The second cavity may be substantially filled with a second liquid.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kollengode Subramanian NARAYANAN, Ion BITA, Suryaprakash GANTI, Brian William ARBUCKLE
  • Publication number: 20130100518
    Abstract: This disclosure provides systems, methods and apparatus for an electromechanical systems device. In one aspect, an electromechanical systems device may include a substrate and a movable layer positioned apart from the substrate. The movable layer and the substrate may define a cavity. The movable layer may be movable to increase the size of the cavity or to decrease the size of the cavity. The movable layer also may include a first anchor point attaching the movable layer to the substrate and a first feature associated with the first anchor point. The first feature may include a protrusion of the movable layer into or out from the cavity.
    Type: Application
    Filed: February 23, 2012
    Publication date: April 25, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Chandra Shekar Reddy Tupelly, Yi Tao, Kostadin Dimitrov Djordjev, Lior Kogut, Brian William Arbuckle, Brian James Gally, Ming-Hau Tung