Patents by Inventor Brian WOZNIAK

Brian WOZNIAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8753148
    Abstract: This invention relates generally to an electrical connector assembly for interconnecting printed circuit boards. More specifically, this invention relates to a high speed, high density electrical connector and connector assembly having wafers with an improved pin conductor. The connector contains a shield plate having at least one contact end that is bent in a direction perpendicular to the plane of the shield plate.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: June 17, 2014
    Assignee: Amphenol Corporation
    Inventor: Brian Wozniak
  • Publication number: 20130130550
    Abstract: This invention relates generally to an electrical connector assembly for interconnecting printed circuit boards. More specifically, this invention relates to a high speed, high density electrical connector and connector assembly having wafers with an improved pin conductor. The connector contains a shield plate having at least one contact end that is bent in a direction perpendicular to the plane of the shield plate.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Applicant: Amphenol Corporation
    Inventor: Brian WOZNIAK