Patents by Inventor Brian Ye

Brian Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124512
    Abstract: Described herein are CD73 inhibitors and pharmaceutical compositions comprising said compounds. The subject compounds and compositions are useful for the treatment of cancer, infections, and neurodegenerative diseases.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 18, 2024
    Inventors: Xiaohui DU, John EKSTEROWICZ, Valeria R. FANTIN, Daqing SUN, Qiuping YE, Jared MOORE, Tatiana ZAVOROTINSKAYA, Brian R. BLANK, Yosup REW, Kejia WU, Liusheng ZHU, Johnny PHAM, Hiroyuki KAWAI
  • Publication number: 20240117366
    Abstract: The present invention relates to methods and compositions for transforming soybean, corn, cotton, or canola explants using spectinomycin as a selective agent for transformation of the explants. The method may further comprise treatment of the explants with cytokinin during the transformation and regeneration process.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 11, 2024
    Inventors: Brian J. Martinell, Michael W. Petersen, David A. Somers, Yuechun Wan, Edward Williams, Xudong Ye
  • Publication number: 20240121882
    Abstract: A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 11, 2024
    Inventors: Brian Toleno, Michael Nikkhoo, Arman Boromand, Sheng Ye, Andrew John Ouderkirk, Jonathan Robert Peterson
  • Publication number: 20240114125
    Abstract: According to one aspect, a method includes obtaining a sensor assembly that includes at least a first camera and a second camera, and positioning the sensor assembly in an enclosure of a sensor testing system. The enclosure has a first enclosure target and a second enclosure target affixed thereon, and includes a sensor arrangement. The sensor testing assembly further includes a computing arrangement and a data acquisition arrangement, The method also includes performing a first test on the sensor assembly by providing commands to the sensor assembly using the computing arrangement, and monitoring the sensor assembly during the first test. Monitoring the sensor assembly includes obtaining data from the sensor assembly and/or the sensor arrangement, and providing the data to the data acquisition arrangement. Finally, the method includes processing the data, wherein processing the data includes determining whether the data indicates that the sensor assembly passes the first test.
    Type: Application
    Filed: September 20, 2023
    Publication date: April 4, 2024
    Applicant: Nuro, Inc.
    Inventors: Fan Yang, Samuel Cheng, Yun Zhang, Brian Hufnagel, Tarik Snyder, Jordan Aaron, Biyu Ye
  • Publication number: 20240093222
    Abstract: The present invention provides methods for the production of viable explants from mature corn seeds, wherein the explant comprises the apical portion of the embryo axis of the corn seed. The present invention also relates to methods for producing such explants and for transforming the explants with a heterologous DNA.
    Type: Application
    Filed: October 3, 2023
    Publication date: March 21, 2024
    Inventors: Yurong Chen, Brian J. Martinell, Anatoly Rivlin, Ashok Shrawat, Yuechun Wan, Edward J. Williams, Xudong Ye
  • Publication number: 20240092947
    Abstract: The present disclosure relates to supported catalyst systems for olefin polymerization, catalyst system precursors, methods of producing the precursors and catalyst systems and polyolefins formed from the catalyst systems.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 21, 2024
    Inventors: Lubin LUO, Francis C. RIX, Kevin A. Stevens, Chi-l KUO, Xiaodan ZHANG, Jacqueline A. LOVELL, Charles J. HARLAN, Xuan YE, Brian R. BERG
  • Patent number: 11919019
    Abstract: An automated mobile paint robot, according to particular embodiments, comprises: (1) a wheeled base; (2) at least one paint sprayer; (3) at least one pump; (4) a vision system; (5) a GPS navigation system; and (5) a computer controller configured to: (A) generate a room painting plan using one or more inputs from the GPS navigation system, vision system, etc.; (B) control movement of the automated mobile paint robot across a support surface: (C) use the vision system to position the wheeled base in a suitable position from which to paint a desired area using the at least one paint sprayer; and (D) use the at least one pump to activate the at least one paint sprayer to paint a swath (e.g., swatch) of paint from the suitable position.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: March 5, 2024
    Assignee: RevolutioNice Inc.
    Inventors: Sreenivas Raman, Brian Jennings, Ryan J. Giovacchini, Elie Cherbaka, Thomas C. Slater, TianHao Ye
  • Patent number: 6217500
    Abstract: A twist-tie cluster is described that includes a plurality of twist ties, each having a wire retained within a strip of material, wherein a cut is made in each of said wires between said first end and said second end, and where an uncut portion of the material connects the twist ties. A connecting means connects first segments of the twist ties together. A twist-tie dispenser is also described including a back wall and a cam member rotatable between a first position and a second position, where the second position traps the twist ties between the back wall and the cam member. A method of dispensing twist-ties is described including trapping a group of twist-ties between a cam member and a back wall.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: April 17, 2001
    Assignee: Twist-Ease, Inc.
    Inventors: James Ray Helseth, Brian Ye